Flame retardant resin material and flame retardant resin composition

ABSTRACT

The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a flame retardant resin materialand a flame retardant resin composition, and more particularly to aflame retardant resin material and a flame retardant resin compositionwhich are improved in flame retardancy, thermal stability or thermaldecomposition resistance, and moisture resistance.

[0002] In order to prevent flame, it is required that resin compositionshas a flame retardancy. Usually, halogen flame retardants are used asflame retardants whilst antimony trioxide is used as a co-flameretardant co-used along with the flame retardant. The halogen flameretardants generate harmful halogen substances typically dioxins. Theantimony trioxide as the co-flame retardant has a chronic toxicity. Forthose reasons, the above substances raise a problem in safety in fire orwaste disposal. Phosphoric flame retardants such as red phosphorus andester phosphate are effective to avoid the above problem. Thosephosphoric flame retardants provide influences to moisture resistance ofthe resin compositions. Particularly, insulators for electroniccomponents are required to have a high reliability . Those phosphoricflame retardants are problem in use for the insulators for electroniccomponents.

[0003] On the other hand, epoxy resin compositions are superior inmechanical properties, adhesive property, chemical resistance property,heat resistance and insulating properties, for which reason the epoxyresin compositions are used in various fields in adhesive, coatingmaterials, laminated plates, molding materials and injection materials.In case of the epoxy resin compositions, halogen flame retardants areused as flame retardants whilst antimony trioxide is used as a co-flameretardant. If the flame retardant and the co-flame retardant are usedfor the epoxy resin composition, problems in not only safety but alsocorrosion of metals are raised. If those epoxy resin compositions areused as insulators for the electronic components, corrosion resistanceto interconnections under high temperature is lowered, wherebyreliability of the electronic device is deteriorated. For this reason,it had been required to develop other epoxy resin compositions free fromthe halogen flame retardant and antimony trioxide.

[0004] It was investigated to improve the flame retardancy of the resinmaterial by introducing a triazine ring into a molecular structure of anepoxy resin or a phenol resin. In Japanese laid-open patent publicationNo. 8-311142, it is disclosed that mixtures of phenols with compoundshaving triazine rings and with aldehydes or phenol condensates such asphenol triazine resins are used as a hardening agent for the epoxy resincompositions. In Japanese laid-open patent publication No. 10-279657, itis disclosed that a phenol triazine epoxy resin obtained byglycidyl-etherification of the above described phenol triazine resin isused as a main component of the epoxy resin composition.

[0005] There is, however, the following problem in introducing thetriazine rings into the molecular structures of the epoxy resins and thephenol resins.

[0006] The flame retardancy of the resin compositions including thephenol triazine resins and the phenol triazine epoxy resins is exhibiteddue to a flame reducing mechanism by flame resistant gases whichcontain, as a main component, nitrogen compounds generated bydecomposition of triazines. If in order to emphasize the flame reducingeffect, a content of nitrogen in the resin composition is increased,then the resistance to the thermal decomposition of the resincomposition is deteriorated, whereby the flame retardancy is thusdeteriorated. Since triazines have hydrophilicity, the increase incontent of the triazines (nitrogen) in the resin composition causes aremarkable reduction in moisture resistance.

[0007] Consequently, it is difficult to further improve the flameretardancy of the resin composition by introducing nitrogen compoundsinto the molecular structure of the resin composition.

[0008] In the above circumstances, it had been required to develop anovel flame retardant resin material and a novel flame retardant resincomposition free from the above problems.

SUMMARY OF THE INVENTION

[0009] Accordingly, it is an object of the present invention to providea novel flame retardant resin material free from the above problems.

[0010] It is a further object of the present invention to provide anovel flame retardant resin material having a high frame retardancy.

[0011] It is a still further object of the present invention to providea novel flame retardant resin material having a high thermal stabilityor a high thermal decomposition resistance.

[0012] It is yet a further object of the present invention to provide anovel flame retardant resin material having a high moisture resistance.

[0013] It is further more of the present invention to provide a novelflame retardant resin composition free from the above problems.

[0014] It is moreover object of the present invention to provide a novelflame retardant resin composition having a high frame retardancy.

[0015] It is another object of the present invention to provide a novelflame retardant resin composition having a high thermal stability or ahigh thermal decomposition resistance.

[0016] It is still another object of the present invention to provide anovel flame retardant resin composition having a high moistureresistance.

[0017] The present invention provides a flame retardant phenol resinmaterial which includes a phenol condensate, wherein a poly-aromaticcompound obtained by a reaction of phenols (A) to aromatics (B) exceptfor phenols and a heterocyclic compound (C) including nitrogen asheteroatom are condensed via aldehydes (D).

[0018] The present invention also provides a flame retardant epoxy resinmaterial which includes an epoxy resin obtained byglycidyl-etherification of at least a part of phenolic hydroxyl groupsof a poly-aromatic compound obtained by a reaction of phenols (A) toaromatics (B) except for phenols and a heterocyclic compound (C)including nitrogen as heteroatom are condensed via aldehydes (D).

[0019] The present invention also provides a flame retardant resincomposition including a flame retardant phenol resin material whichincludes a phenol condensate, wherein a poly-aromatic compound obtainedby a reaction of phenols (A) to aromatics (B) except for phenols and aheterocyclic compound (C) including nitrogen as heteroatom are condensedvia aldehydes (D).

[0020] The present invention also provides a flame retardant resincomposition including a flame retardant epoxy resin material whichincludes an epoxy resin obtained by glycidyl-etherification of at leasta part of phenolic hydroxyl groups of a poly-aromatic compound obtainedby a reaction of phenols (A) to aromatics (B) except for phenols and aheterocyclic compound (C) including nitrogen as heteroatom are condensedvia aldehydes (D).

[0021] The above and other objects, features and advantages of thepresent invention will be apparent from the following descriptions.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Preferred embodiments according to the present invention will bedescribed in detail with reference to the accompanying drawings.

[0023]FIG. 1A is a schematic view illustrative of a flame retardantmechanism of a flame retardant resin composition having a foam layerfree of nitrogen based frame reducing gas.

[0024]FIG. 1B is a schematic view illustrative of a flame retardantmechanism of a flame retardant resin composition having a foam layerfilled with nitrogen based frame reducing gas.

DISCLOSURE OF THE INVENTION

[0025] The first present invention provides a flame retardant phenolresin material which includes a phenol condensate, wherein apoly-aromatic compound obtained by a condensation reaction of phenols(A) to aromatics (B) except for phenols and a heterocyclic compound (C)including nitrogen as heteroatom are condensed via aldehydes (D).

[0026] It is preferable that the aromatics (B) are represented by thefollowing chemical formula (1),

XH₂C—R₁—CH₂X  (1)

[0027] where R₁ is any one of biphenyl derivatives, phenylenederivatives, naphthalene derivatives, biphenylene derivatives, fluorenederivatives, bis-phenol fluorene derivatives, and X is any one ofhalogen atoms, hydroxyl groups and alkoxyl groups having not larger than10 carbon atoms.

[0028] It is further preferable that the R₁ is any one of biphenylderivatives and phenylene derivatives.

[0029] It is also preferable that the heterocyclic compound (C) istriazines.

[0030] It is further preferable that the triazines include compoundshaving at least one amino group.

[0031] It is also preferable that the triazines are at least onecompound selected from the groups consisting of melamine, acetoguanamineand benzoguanamine.

[0032] The second present invention provides a flame retardant resincomposition which includes at least a flame retardant phenol resinmaterial of the first present invention.

[0033] It is preferable to further include an aromatic thermosettingresin having aromatic rings on a main chain skeleton.

[0034] It is further preferable that the aromatic thermosetting resincomprises an epoxy resin having a novolak structure.

[0035] It is also preferable that the aromatic thermosetting resincomprises a phenol resin having a novolak structure.

[0036] It is also preferable that the aromatic thermosetting resincomprises a phenol aralkyl epoxy resin having aromatic rings on anovolak-structured main chain.

[0037] It is further preferable that the phenol aralkyl epoxy resin hasat least any one of biphenyl derivatives and phenylene derivatives onthe novolak-structured main chain.

[0038] It is also preferable that the aromatic thermosetting resincomprises a phenol aralkyl phenol resin having aromatic rings on anovolak-structured main chain.

[0039] It is further preferable that the phenol aralkyl phenol resin hasat least any one of biphenyl derivatives and phenylene derivatives onthe novolak-structured main chain.

[0040] It is also preferable to further include an aromaticthermoplastic resin having aromatic rings on a main chain skeleton.

[0041] The third present invention provides a semiconductor devicehaving a sealing resin which comprises a flame retardant resincomposition of the second present invention.

[0042] The fourth present invention provides a printed wiring boardhaving an insulator which comprises a flame retardant resin compositionof the second present invention.

[0043] The fifth present invention provides a molding materialcomprising a flame retardant resin composition of the second presentinvention.

[0044] The sixth present invention provides a flame retardant epoxyresin material which includes an epoxy resin obtained byglycidyl-etherification of at least a part of phenolic hydroxyl groupsof a poly-aromatic compound obtained by a condensation reaction ofphenols (A) to aromatics (B) except for phenols and a heterocycliccompound (C) including nitrogen as heteroatom via aldehydes (D).

[0045] It is preferable that the aromatics (B) are represented by thefollowing chemical formula (1),

XH₂C—R₁—CH₂X  (1)

[0046] where R₁ is any one of biphenyl derivatives, phenylenederivatives, naphthalene derivatives, biphenylene derivatives, fluorenederivatives, bis-phenol fluorene derivatives, and X is any one ofhalogen atoms, hydroxyl groups and alkoxyl groups having not larger than10 carbon atoms.

[0047] It is further preferable that the R₁ is any one of biphenylderivatives and phenylene derivatives.

[0048] It is also preferable that the heterocyclic compound (C) istriazines.

[0049] It is further preferable that the triazines include compoundshaving at least one amino group.

[0050] It is also preferable that the triazines are at least onecompound selected from the groups consisting of melamine, acetoguanamineand benzoguanamine.

[0051] The seventh present invention provides a flame retardant resincomposition which includes at least a flame retardant epoxy resinmaterial of the sixth present invention.

[0052] It is preferable to further include an aromatic thermosettingresin having aromatic rings on a main chain skeleton.

[0053] It is further preferable that the aromatic thermosetting resincomprises an epoxy resin having a novolak structure.

[0054] It is also preferable that the aromatic thermosetting resincomprises a phenol resin having a novolak structure.

[0055] It is also preferable that the aromatic thermosetting resincomprises a phenol aralkyl epoxy resin having aromatic rings on anovolak-structured main chain.

[0056] It is further preferable that the phenol aralkyl epoxy resin hasat least any one of biphenyl derivatives and phenylene derivatives onthe novolak-structured main chain.

[0057] It is also preferable that the aromatic thermosetting resincomprises a phenol aralkyl phenol resin having aromatic rings on anovolak-structured main chain.

[0058] It is further preferable that the phenol aralkyl phenol resin hasat least any one of biphenyl derivatives and phenylene derivatives onthe novolak-structured main chain.

[0059] It is also preferable to further include an aromaticthermoplastic resin having aromatic rings on a main chain skeleton.

[0060] The eighth present invention provides a semiconductor devicehaving a sealing resin which comprises a flame retardant resincomposition of the seventh present invention.

[0061] The ninth present invention provides a printed wiring boardhaving an insulator which comprises a flame retardant resin compositionof the seventh present invention.

[0062] The tenth present invention provides a molding materialcomprising a flame retardant resin composition of the seventh presentinvention.

[0063] Accordingly, the present invention provides a flame retardantphenol resin material which includes a phenol condensate, wherein apoly-aromatic compound obtained by a reaction of phenols (A) toaromatics (B) except for phenols and a heterocyclic compound (C)including nitrogen as heteroatom are condensed via aldehydes (D).

[0064] The present invention also provides a flame retardant epoxy resinmaterial which includes an epoxy resin obtained byglycidyl-etherification of at least a part of phenolic hydroxyl groupsof a poly-aromatic compound obtained by a reaction of phenols (A) toaromatics (B) except for phenols and a heterocyclic compound (C)including nitrogen as heteroatom are condensed via aldehydes (D).

[0065] The present invention also provides a flame retardant resincomposition including a flame retardant phenol resin material whichincludes a phenol condensate, wherein a poly-aromatic compound obtainedby a reaction of phenols (A) to aromatics (B) except for phenols and aheterocyclic compound (C) including nitrogen as heteroatom are condensedvia aldehydes (D).

[0066] The present invention also provides a flame retardant resincomposition including a flame retardant epoxy resin material whichincludes an epoxy resin obtained by glycidyl-etherification of at leasta part of phenolic hydroxyl groups of a poly-aromatic compound obtainedby a reaction of phenols (A) to aromatics (B) except for phenols and aheterocyclic compound (C) including nitrogen as heteroatom are condensedvia aldehydes (D).

[0067] The above flame retardant resin compositions may include anaromatic thermosetting resin having an aromatic ring in a main chainskeleton.

[0068] The above flame retardant resin compositions may include anaromatic thermoplastic resin having an aromatic ring in a main chainskeleton.

[0069] The present invention also provides a semiconductor device usinga sealing resin which comprises the above flame retardant resincomposition.

[0070] The present invention also provides an electronic or electriccomponent having a semiconductor device using a sealing resin whichcomprises the above flame retardant resin composition.

[0071] The present invention also provides a printed wiring board usingan insulator material which comprises the above flame retardant resincomposition.

[0072] The present invention also provides a molding material comprisinga flame retardant thermosetting resin which comprises the above flameretardant resin composition.

[0073] The present invention also provides a molding material comprisinga flame retardant thermoplastic resin which comprises the above flameretardant resin composition.

[0074] In this specification, “flame retardant phenol resin material” isdefined to be a phenol resin material, wherein a phenol condensatehaving the above structure is optionally mixed with other phenol resins.“flame retardant epoxy resin material” is defined to be an epoxy resinmaterial, wherein an epoxy resin having the above structure isoptionally mixed with other epoxy resins. “frame retardant resincomposition” includes the above flame retardant phenol resin materialsand/or the above flame retardant epoxy resin materials which mayoptionally be mixed with fillers, flame retardants such as metalhydroxides, phosphoric compounds except for halogen compounds or otheradditives.

[0075] The flame retardant phenol resin materials and the flameretardant epoxy resin materials in accordance with the present inventionwill hereinafter be referred to as “flame retardant resin materials”.The flame retardant resin material has the aromatics (B) and theheterocyclic compound (C) in its condensate, for which reason the flameretardant resin material is superior in flame retardancy as compared tothe conventional flame retardant resin materials.

[0076] If, in accordance with the prior art, the flame retardant resinmaterial having molecular skeletons introduced with the heterocycliccompound (C) including nitrogen atoms as the heteroatom therein is addedinto the resin composition, then nitrogen based flame resistant gasesare generated by ignition, whereby the flame resistant gases aredispersed to an atmosphere and an insufficient flame retarding effect isobtained. It is necessary for obtaining a sufficient flame retardingeffect to generate a large amount of the nitrogen based flame resistantgases. The source of the nitrogen based flame resistant gases istriazine ring. If the content of the triazine rings in the resincomposition is increased, then the thermal stability or the resistanceto the thermal decomposition is deteriorated, whereby the flameretardancy is deteriorated and the moisture resistance and otherproperties are also deteriorated.

[0077] In accordance with the present invention, the flame retardantresin material having both the aromatics (B) and the heterocycliccompound (C) in the condensate is added to the resin composition toexhibit a novel flame retarding mechanism different from theconventional technique.

[0078] The novel flame retarding mechanism will hereinafter be describedby taking an example of a thermosetting resin including the flameretardant resin material.

[0079] The flame retardant resin material in accordance with the presentinvention includes aromatics (B). The flame retardant resin compositionincluding the flame retardant resin material is low in bridge density inthermosetting resin composition, for which reason decomposition gasesgenerated by ignition of the resin composition expends a surface of theresin composition to form a foam layer. The addition of the above flameretardant resin composition causes this foam layer to include phenolssuperior in thermal stability or thermal decomposition resistance andaromatic derivatives or poly-aromatics, whereby the resin compositionhas a high hot strength which suppress foam-breaking. Oxygen or heat areshielded by this foam layer, whereby a high flame retarding effect canbe obtained.

[0080] In addition to the aromatics (B), the heterocyclic compound (C)is introduced into the molecular skeletons of the flame retardant resincomposition in order to not only prevent the spreading fire but alsocause the foam layer to reduce the fire for obtaining a higher flameretardancy. Namely, the flame retardant resin composition in accordancewith the present invention includes the heterocyclic compound (C). Thenitrogen based flame resistant gases are generated in ignition. A partof the generated gases is diffused into the atmosphere whilst theremaining part thereof fills the foam layer. The foam layer filled withthe nitrogen based flame resistant gases not only prevents the spreadingfire but also reducing the fire. This mechanism will be described withreference to the drawing. FIG. 1A is a schematic view illustrative of aflame retardant mechanism of a flame retardant resin composition havinga foam layer free of nitrogen based frame reducing gas. A left side edgeof a resin product 1 is burned or fired and a fire face 3 is made spreadtoward a foam layer 2 which prevents the fire spread. If the fire face 3is made close to the foam layer 2, some of forms are broken, whereby itis no longer possible to prevent the fire spread. FIG. 1B is a schematicview illustrative of a flame retardant mechanism of a flame retardantresin composition having a foam layer filled with nitrogen based framereducing gas. A left side edge of a resin product 1′ is burned or firedand a fire face 3′ is made spread toward a foam layer 2 which reducesthe fire. If the fire face 3 is made close to the foam layer 2, some offorms are broken, whereby the nitrogen based gases 4 are injected to thefire, and the fire is reduced by the nitrogen based gases. Namely, thefoam layer 2′ serves as a reservoir layer for reserving the nitrogenbased flame reducing gases 4′ which are capable of fire extinction. Thethermosetting resin composition including the flame retardant resinmaterial exhibits the higher flame retardancy than that of theconventional resin composition. It is also possible to cause a highmultiplier effect in flame retardancy by the flame retardant resinmaterial to a resin composition having a base material of an aromaticthermosetting resin having aromatic rings on the main chain skeleton,for example, an epoxy resin containing a novolak structure and/or anepoxy resin composition having a base material of an epoxy resincontaining a novolak structure, particularly a phenol aralkyl type epoxyresin having aromatic rings on a novolak-structured main chain skeletonand/or a phenol aralkyl type phenol resin having aromatic rings on anovolak-structured main chain skeleton. The aromatic thermosetting resinhaving the aromatic rings on the main chain skeleton is high in thermalstability and shows a high compatibility with the flame retardant resinmaterial, whereby a uniform and stable foam layer can be obtained inignition. Particularly, an extremely stable foam layer can be obtainedby using an epoxy resin containing a novolak structure and/or an epoxyresin composition having a base material of an epoxy resin containing anovolak structure, particularly a phenol aralkyl type epoxy resin havingaromatic rings on a novolak-structured main chain skeleton and/or aphenol aralkyl type phenol resin having aromatic rings on anovolak-structured main chain skeleton.

[0081] The flame retardant resin material in accordance with the presentinvention has both the aromatics (B) and the heterocyclic compound (C)in the same condensate so that the resin composition containing theflame retardant resin material has a high flame retardancy and a highmoisture resistance. If, differently from the present invention, theresin composition having a molecular skeleton introduced with thearomatics (B) and a different molecular skeleton introduced with theheterocyclic compound (C) does not have both a high flame retardancy anda high moisture resistance. For example, a resin composition having aphenol biphenyl aralkyl epoxy resin having a biphenyl group on themolecular skeleton and a phenol resin having triazine rings does nothave a sufficiently high flame retardancy and moisture resistance. Thehigh flame retardancy and the high moisture resistance shown by theflame retardant resin material of the present invention can be obtainedby introducing the aromatics (B) which are superior in both the thermalstability or resistance to the thermal decomposition and thehydrophobicity. Addition of the resin composition with the flameretardant resin material having the aromatics (B) and the heterocycliccompound (C) in the same condensate in accordance with the presentinvention results in improvements in both the flame retardancy and themoisture resistance.

[0082] The above descriptions about the flame retardancy mechanism ofthe flame retardant resin material have been made by taking, as oneexample, the thermosetting resin composition. The above novel flameretardant resin material is, of course, applicable to thermoplasticresin composition to obtain such the high flame retardancy. Similarly tothe above described thermosetting resin composition, the thermoplasticresin composition containing the flame retardant resin material of thepresent invention causes a foam layer to be formed in ignition, whereinthe foam layer is superior in thermal stability or resistance to thethermal decomposition, whereby the thermoplastic resin compositionexhibits a high flame retardancy. The thermoplastic resin compositioncontaining the flame retardant resin material having both the aromatics(B) and the heterocyclic compound (C) in the same condensate providesthe large effects. The combination of the aromatics in the flameretardant resin material is compatible with the aromatic rings, forwhich reason the aromatic thermoplastic resin composition having thearomatic rings on the main chain skeleton is preferable in view ofimprovement in the flame retardancy.

[0083] In accordance with the present invention, phenols (A) are notlimited provided that an aromatic compound having a hydroxyl group. Forexample, there are available as the phenols (A) phenol, naphthols suchas α-naphthol and β-naphthol, bisphenol fluorene type phenol, alkylphenols such as cresol, xylenol, ethyl phenol, butyl phenol, nonylphenol, and octyl phenol, polyhydric phenols such as bis-phenol A,bis-phenol F, bis-phenol S, resorcin and catechol, phenyl phenol, andamino phenol. Those phenols may be used alone or in combination.

[0084] In accordance with the present invention, the aromatics (B)comprises one or more aromatic compounds except for the above describedphenols (A). The aromatics (B) are not limited provided that thearomatics (B) are chemically reacted and bonded with the phenols (A). Itis preferable that the aromatics (B) are represented by the followingchemical formula (1).

XH₂C—R₁—CH₂X  (1)

[0085] where R₁ is any one of biphenyl derivatives, phenylenederivatives, naphthalene derivatives, biphenylene derivatives, fluorenederivatives, bis-phenol fluorene derivatives, and anthracenederivatives, and X is any one of halogen atoms, hydroxyl groups andalkoxyl groups having not larger than 10 carbon atoms.

[0086] The biphenyl derivatives means a divalent group derived fromsubstitutional or unsubstitutional biphenyl. The substitutional biphenylmay be, for example, hydrocarbon groups having a chain-structureincluding unsaturated bonds of 1-6 carbon atoms such as allyl groups,and alkyl groups of 1-6 carbon atoms.

[0087] The phenylene derivatives means a divalent group derived fromsubstitutional or unsubstitutional phenylene. The substitutionalphenylene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms. The phenylenederivatives include divalent groups derived from diphenyl ether,divalent groups derived from bis-phenol A, divalent groups derived frombis-phenol F, and divalent groups derived from bis-phenol S.

[0088] The naphthalene derivatives means a divalent group derived fromsubstitutional or unsubstitutional naphthalene. The substitutionalnaphthalene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0089] The biphenylene derivatives means a divalent group derived fromsubstitutional or unsubstitutional biphenylene. The substitutionalbiphenylene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0090] The fluorene derivatives means a divalent group derived fromsubstitutional or unsubstitutional fluorene. The substitutional fluorenemay be, for example, hydrocarbon groups having a chain-structureincluding unsaturated bonds of 1-6 carbon atoms such as allyl groups,and alkyl groups of 1-6 carbon atoms.

[0091] The bis-phenol fluorene derivatives means a divalent groupderived from substitutional or unsubstitutional bis-phenol fluorene. Thesubstitutional bis-phenol fluorene may be, for example, hydrocarbongroups having a chain-structure including unsaturated bonds of 1-6carbon atoms such as allyl groups, and alkyl groups of 1-6 carbon atoms.

[0092] The anthracene derivatives means a divalent group derived fromsubstitutional or unsubstitutional anthracene. The substitutionalanthracene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0093] It is preferable that R₁ is any one of biphenyl derivatives,phenylene derivatives, whereby a thermosetting resin composition havinga low bridge density can be obtained. A foam layer in a form of rubberwhich is superior in thermal decomposition resistance is formed inignition. Biphenyl and derivatives thereof as well as phenylene andderivatives thereof are superior in hydrophobicity, for which reasonintroduction of them causes a great improvement in moisture resistanceof the resin composition.

[0094] The aromatics (B) are not limited provided that the aromatics (B)are chemically reacted and bonded with the phenols (A). The aromatics(B) may be a compound represented by the following general formula (1).

[0095] where a hydrogen atom bonded to a carbon atom of methylene chain(—CH₂—) is substituted with other substituent (R′). This substituent(R′) may be, for example, a hydrocarbon group having 1-10 carbon atomsand/or an alkoxyl group having 1-10 carbon atoms as well as polymersbased on other hydrocarbons.

[0096] In accordance with the present invention, heterocyclic compound(C) including nitrogen as heteroatom serves as a source of flamereducing gas. The heterocyclic compound (C) includes one or morenitrogen atoms, and optionally may further include other atoms such assulfur as heteroatom. It is particularly preferable that theheterocyclic compound (C) including nitrogen as heteroatom is triazines.The triazines means compounds having one or more triazine rings toeffectively discharge flame reducing nitrogen based gases.

[0097] It is preferable that the triazines have at least one amino groupso that the triazines and the poly-aromatics obtained by reaction of thephenols (A) with the aromatics (B) except for phenols may easilycondensed via the aldehydes (D).

[0098] It is preferable that the triazines are represented by thefollowing general formulae (2) and (3) so as to effectively dischargeflame reducing nitrogen based gases.

[0099] where each of R₂, R₃, and R₄ is any one of amino groups, phenylgroups, alkyl groups having 1-12 carbon atoms, hydroxyl groups, hydroxylalkyl groups, ether groups, ester groups, carboxyl groups, unsaturatedhydrocarbon groups, cyano groups, thiol groups, halogen atoms. It ispreferable that if R₂, R₃, and R₄ are substituted with alkyl groups, thenumber of alkyl groups in the formula is not more than 2 and others arethe above reactive functional groups.

[0100] where each of R₅, R₆, and R₇ is any one of hydrogen atom, alkylgroups having 1-12 carbon atoms, phenyl groups, hydroxyl groups,hydroxyl alkyl groups, ester groups, carboxyl groups, unsaturatedhydrocarbon groups, cyano groups, halogen atoms. It is preferable thatif R₅, R₆, and R₇ are substituted with alkyl groups, the number of alkylgroups in the formula is not more than 2 and others are the abovereactive functional groups.

[0101] As described above, it is preferable that at least one of R₂, R₃,and R₄ is amino groups. The compounds represented by the general formula(2) may be, for example, the triazine derivatives such asbenzoguanamine, acetoguanamine and melamine, cyanuric acid derivativessuch as cyanuric acid, methyl cyanurate, ethyl cyanurate, acetylcyanurate, cyanuric chloride. It is more preferable that the triazinederivative is benzoguanamine (the following general formula (4)),acetoguanamine(the following general formula (5)), melamine (thefollowing general formula (6)). Benzoguanamine is most preferablebecause this compound makes the heterocyclic compound (C) easy to becompatible with the poly-aromatics obtained by the reaction of thephenols (A) with the aromatics (B) except for phenols and with thealdehydes (D), resulting in an efficient reaction and improvement inmoisture resistance of the flame retardant resin material.

[0102] It is also preferable that at least one of is R₅, R₆, and R₇ ishydrogen atom. The compounds represented by the general formula (3) maybe, for example, isocyanuric acid derivatives such as isocyanuric acid,methyl isocyanurate, methyl isocyanurate, ethyl isocyanurate, allylisocyanurate, 2-hydroxyethyl isocyanurate, 2-carboxylethyl isocyanurate,isocyanuric chloride. It is most preferable that all of R₅, R₆, and R₇are hydrogen atoms. The cyanuric acid represented in the general formula(2) as tautomer of those compounds is also preferable.

[0103] The compounds of the general formulae (2) and (3) may be usedalone or in combination.

[0104] In accordance with the present invention, the aldehydes (D) arenot limited but formaldehyde is preferable as being convenient in use.Typical sources are, for example, formalin and paraformaldehyde.

[0105] The flame retardant phenol resin material of the presentinvention includes a phenol condensate in which the components (A), (B),(C) and (D) are condensed. The flame retardant epoxy resin material ofthe present invention includes an epoxy resin, wherein the phenolcondensate is glycidyl-etherificated.

[0106] It is preferable that an epoxy resin is contained in the flameretardant phenol resin material of the present invention to obtain aresin composition superior in flame retardancy, mixing stability,thermal stability and moisture resistance and other properties, whereinthe phenol condensate of the present invention serves as a thermosettingagent for the epoxy resin composition.

[0107] Similarly, it is also preferable that a thermosetting agent forepoxy resin is included in the flame retardant epoxy resin material ofthe present invention to obtain a resin composition superior in flameretardancy, mixing stability, thermal stability and moisture resistanceand other properties.

[0108] The flame retardant resin material of the present invention isparticularly effective for flame retardation of the epoxy resincomposition. The epoxy resin and the epoxy resin thermosetting agentserve as the base materials of the epoxy resin composition including theflame retardant resin material of the present invention. As the epoxyresin and the epoxy resin thermosetting agent, an epoxy resin containinga novolak structure and a phenol resin containing a novolak structureare preferable. Particularly, a phenol aralkyl type epoxy resin havingaromatic rings on the novolak-structured main chain skeleton and aphenol aralkyl type phenol resin having aromatic rings on thenovolak-structured main chain skeleton are further preferable. As thephenol aralkyl type epoxy resin and the phenol aralkyl type phenolresin, there is used for the base material of the epoxy resin, at leastany one of phenolbiphenylaralkyl epoxy resin, phenolbiphenylaralkylphenol resin, phenolphenylenearalkyl epoxy resin, phenolphenylenearalkylphenol resin, phenoldiphenylaralkyl epoxy resin, phenoldiphenylaralkylphenol resin, naphtholaralkyl epoxy resin, naphtholaralkyl phenol resin,phenolanthracenearalkyl epoxy resin, and phenolanthracenearalkyl phenolresin.

[0109] The co-use of the flame retardant resin material of the presentinvention along with epoxy resin and/or the thermosetting material forthe epoxy resin is effective to provide a suitable resin composition fora sealing resin of semiconductor device and insulator for printed board.

[0110] The flame retardant resin material of the present invention isalso effective for flame retardation of other resin compositions thanthe epoxy resin composition. Particularly, the flame retardant resinmaterial of the present invention may be well compatible and uniformlydispersed. The flame retardant resin material of the present inventionis effective for the aromatic thermosetting resins having the aromaticrings on the main chain skeleton, for example, phenol resins and resincompositions having polyester as the base material and for the aromaticthermoplastic resins having the aromatic rings on the main chainskeleton, for example, polycarbonate, polystyrene, co-polymer (AB) ofacrylonitrile and styrene, co-polymer (ABS) of acrylonitrile, butadieneand styrene, polyphenylene ether, polybutylene terephthalate, nylon, andresin compositions having a base material of polymer alloy comprising atleast two of them. The flame retardant resin material of the presentinvention is also effective for resin compositions having a basematerial of olefins, and optionally together with dispersing agent forobtaining a higher flame retardancy.

[0111] The flame retardant phenol resin material of the presentinvention uses the specific-structured condensate which includes theabove components (A), (B), (C) and (D) in one molecule, for which reasonthere is no limitation to molecular weight. As the phenol condensate,plural types of the substances different in molecular weight may beincluded in the condensate.

[0112] The flame retardant epoxy resin material of the present inventionalso uses the specific-structured condensate which includes the abovecomponents (A), (B), (C) and (D) in one molecule, for which reason thereis no limitation to molecular weight. As the epoxy resin, plural typesof the substances different in molecular weight may be included in thecondensate.

[0113] The flame retardant resin composition of the present inventionmay include any one of the flame retardant phenol resin material and theflame retardant epoxy resin material or include the both. The flameretardant resin composition of the present invention may furtherpreferably include the aromatic thermosetting resin having aromaticrings on the main chain skeleton or the aromatic thermoplastic resinhaving aromatic rings on the main chain skeleton. It is particularlypreferable that the flame retardant resin composition of the presentinvention may further include the above aromatic thermosetting resin.Those resins have good compatibility with the flame retardant resinmaterial of the present invention, for which reason a uniform andextremely stable foam layer can be obtained in ignition to cause aremarkable flame retardancy. Particularly, if the above aromaticthermosetting resin comprises an epoxy resin containing a novolakstructure and/or a phenol resin containing a novolak structure, forexample, if the above aromatic thermosetting resin comprises a phenolaralkyl type epoxy resin having aromatic rings on a novolak-structuredmain chain skeleton and/or a phenol aralkyl type phenol resin havingaromatic rings on a novolak-structured main chain skeleton, then moreremarkable effect of flame retardation can be obtained. It is preferablethat the above phenol aralkyl type epoxy resin includes biphenylderivatives and/or phenylene derivatives on the main chain skeleton. Itis preferable that those aromatic thermosetting resins are used as thebase material in the resin composition, to cause a multiplier effect inthe flame retardation.

[0114] A typical method of preparing the phenol condensate in accordancewith the present invention will be described even other methods may beavailable.

[0115] The phenols (A) are reacted with the aromatics (B) under anacidic catalyst to cause a condensation reaction to form a condensaterepresented by the following general formula (7). The above condensationreaction is made under the conditions that a molar ratio of the phenols(A) to the aromatics (B) is ranged from 0.3:1 to 20:1, preferably from0.4:1 to 15:1.

[0116] where “n” is 0.0 to 10, preferably 0.0 to 3.0, and morepreferably 0.0 to 1.0, R₀—OH is any one of phenol derivatives, naphtholderivatives, derivatives of poly-phenol such as bis-phenol fluorenederivatives, bis-phenol A, bis-phenol phenol F, bis-phenol S, resorcin,and catechol, and derivatives of alkyl phenols.

[0117] R₁ is any one of biphenyl derivatives, phenylene derivatives,naphthalene derivatives, biphenylene derivatives, fluorene derivatives,bis-phenol fluorene derivatives, and anthracene derivatives.

[0118] The biphenyl derivatives means a divalent group derived fromsubstitutional or unsubstitutional biphenyl. The substitutional biphenylmay be, for example, hydrocarbon groups having a chain-structureincluding unsaturated bonds of 1-6 carbon atoms such as allyl groups,and alkyl groups of 1-6 carbon atoms.

[0119] The phenylene derivatives means a divalent group derived fromsubstitutional or unsubstitutional phenylene. The substitutionalphenylene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms. The phenylenederivatives include divalent groups derived from diphenyl ether,divalent groups derived from bis-phenol A, divalent groups derived frombis-phenol F, and divalent groups derived from bis-phenol S.

[0120] The naphthalene derivatives means a divalent group derived fromsubstitutional or unsubstitutional naphthalene. The substitutionalnaphthalene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0121] The biphenylene derivatives means a divalent group derived fromsubstitutional or unsubstitutional biphenylene. The substitutionalbiphenylene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0122] The fluorene derivatives means a divalent group derived fromsubstitutional or unsubstitutional fluorene. The substitutional fluorenemay be, for example, hydrocarbon groups having a chain-structureincluding unsaturated bonds of 1-6 carbon atoms such as allyl groups,and alkyl groups of 1-6 carbon atoms.

[0123] The bis-phenol fluorene derivatives means a divalent groupderived from substitutional or unsubstitutional bis-phenol fluorene. Thesubstitutional bis-phenol fluorene may be, for example, hydrocarbongroups having a chain-structure including unsaturated bonds of 1-6carbon atoms such as allyl groups, and alkyl groups of 1-6 carbon atoms.

[0124] The anthracene derivatives means a divalent group derived fromsubstitutional or unsubstitutional anthracene. The substitutionalanthracene may be, for example, hydrocarbon groups having achain-structure including unsaturated bonds of 1-6 carbon atoms such asallyl groups, and alkyl groups of 1-6 carbon atoms.

[0125] The condensate represented in the above general formula (7) may,for example, be substances represented by the following formulae (8)through (18), but should not limited to those substances.

[0126] In the above condensation reaction, acidic catalysts are used.Various types of the acidic catalysts may be used, for example, organicor inorganic acids such as p-toluenesulfonate, sulfuric acid,hydrochloric acid, oxalic acid, Lewis acids such as boron trifluoride,aluminum chloric anhydride, and zinc chloride, particularly,p-toluenesulfonate, sulfuric acid, hydrochloric acid are preferable.There is no limitation to the amount in use of those acidic catalyst but0.1-30% by weight is preferable.

[0127] The above condensation reaction may be made in the absence of orin the presence of organic solvents. Available organic solvents may, forexample, be methyl cellosolve, ethyl cellosolve, toluene, xylene,methylisobutylketone, The amount in use of the organic solvent isnormally 50-300% by weight, preferably 100-250% by weight to a totalweight of the source materials. A reaction temperature is normally40-180° C. A reaction time is normally 1-10 hours. Those organicsolvents may be used alone or in combination. A water and an alcoholgenerated during the reaction may preferably be removed by use offractional distillation tube to promote the reaction.

[0128] After the reaction, a water cleaning treatment is carried outuntil a cleaning solution pH value becomes 3-7, preferably 5-7. For thewater cleaning treatment, there may be used, as neutralization agents,basic substances, for example, alkali metal hydroxide such as sodiumhydroxide and potassium hydroxide, alkali earth metal hydroxide such ascalcium hydroxide and magnesium hydroxide, ammonia, sodiumdihydrogenphosphate, and organic amines such as diethylene triamine,triethylene tetraamine, aniline and phenylene diamine. The watercleaning treatment may be carried out by the normal method. For example,the reaction mixture is added with a water solved with the aboveneutralization agents to repeat separating extraction operation.

[0129] After the neutralization treatment, the solvent and unreactedsubstances are removed under a low pressure at a heated condition tocause a condensation of the product to form a condensate represented bythe above general formula (7).

[0130] The condensate typically represented by the above general formula(7), heterocyclic compound (C) having nitrogen as heteroatom and thealdehydes (D) are reacted under conditions of 4-10 pH, preferable 5-9pH. The condensate typically represented by the above general formula(7) is condensed with the heterocyclic compound (C) having nitrogen asheteroatom via the aldehydes (D) to form a phenol condensate. Thiscondensation reaction may be made with or without catalyst. The kinds ofcatalysts are not limited but basic catalyst is preferable.

[0131] The available basic catalysts may, for example, be alkali metalhydroxide such as sodium hydroxide and potassium hydroxide, alkali earthmetal hydroxide such as barium hydroxide, and oxides of those alkalimetal hydroxide and alkali earth metal hydroxide, ammonia, primary,secondary ternary amines, hexamethylenetetraamine, and sodium carbonate.If the phenol resin of the present invention is used as thethermosetting agent to the epoxy resin compositions for electric orelectronic devices, it is preferable to use amines to avoid thatinorganic substances as metal resides as the residual catalyst.

[0132] There is no limitation to the sequences of the reactions. It ispossible that the condensate represented by the above general formula(7) is reacted with the aldehydes (D) before the heterocyclic compound(C) having nitrogen as heteroatom is added thereto. It is also possiblethat the heterocyclic compound (C) having nitrogen as heteroatom isreacted with the aldehydes (D) before the condensate represented by theabove general formula (7) is then added thereto. It is also possiblethat the condensate represented by the above general formula (7), theheterocyclic compound (C) and the aldehydes (D) are concurrently addedto case the reaction. A molar ratio of the condensate represented by theabove general formula (7) to the heterocyclic compound (C) and thealdehydes (D) is not limited but preferably 1:(0.1-10):(0.1-10), andmore preferably 1:(0.2-5):(0.2-5).

[0133] In view of control the reaction, it is also possible the reactionis made in the presence of various solvents. There is no limitation tothe kinds of the solvents but available solvents may, for example, beacetone, methyl ethylketone, toluene, xylene, methyl isobutylketone,ethyl acetate, ethyleneglycolmonomethylether, N,N′-dimethylformamide,methanol and ethanol. Those solvents may be used alone or incombination.

[0134] The neutralization and water cleaning may, if any be carried outto remove impurities such as salts. If, however, amines are used as thecatalyst, there is no need to carry out these processes. After thereaction, unreacted substances and the used catalysts are removed by thenormal methods such as distillation under atmospheric pressure or invacuum. It is necessary to carry out a heat treatment at 120° C. forobtain the resin substantially free of unreacted aldehydes and methylolgroups. A heat treatment at a temperature below 120° C. is incapable ofcomplete disappearance of the methylol groups. The heat treatment atabove 120° C. for a sufficient time period is capable of completedisappearance of the methylol groups. The heat treatment at above 150°C. is preferable. At this high temperature, a distillation maypreferably be carried out in accordance with the method of obtaining thenovolak resins together with heating the same.

[0135] The phenol condensate of the present invention is useable for theflame retardant of the resin composition or the thermosetting agent.Examples of the phenol condensate of the present invention arerepresented by the following general formulae (19) through (30).

[0136] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0137] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0138] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0139] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0140] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0141] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0142] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0143] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0144] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0145] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0146] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0147] where R8 is any one of phenyl groups, alkyl groups of 1-12 carbonatoms, amino groups, hydroxyl groups, hydroxylalkyl groups, ethergroups, ester groups, carboxyl groups, unsaturated hydrocarbon groups,thiol groups, and cyano groups, and “n” is 0.0-10, preferably 0.0-3.0,more preferably 0.0-1.0, and “m” is 1.0-10, preferably 1.0-5.0, morepreferably 1.0-2.0.

[0148] The flame retardant resin material including the phenolcondensate may be used for the frame retardant to the resin compositionor the thermosetting agent in combination with other phenol resins oramine compounds. The available phenol resins in combination are notlimited but may, for example, be phenolbiphenylaralkyl resins,phenolphenylenearalkyl resins, phenoldiphenylaralkyl resins,naphthalene-containing phenol resins such as naphtholaralkyl resins,phenoltriazine resins, at least one or combination ofbiphenyl-4,4′-dihydroxyether, and 3,3′,5,5′-tetramethylbiphenyl-4,4′-dihydroxyethr, tetraphenyrolethane, trisphenyrolethane,phenol novolak resins, cresol novolak resins, bis-phenol A resin,bis-phenol F resin, bis-phenol S resin, polyphenol resin, aliphaticester phenol resin, cyclic aliphatic ester phenol resin, and ether esterphenol resin. Available amine compounds in combination are not limitedbut may, for example, be diamino diphenylmethane, diethylene triamine,and diaminodiphenylsulfone. Those phenol resins and the amine resins maybe used alone or in combination. Phenolbiphenylaralkyl resins,phenolphenylenearalkyl resins, phenoldiphenylaralkyl resins, andnaphtholaralkyl resins are particularly preferable.

[0149] The flame retardant epoxy resin material of the present inventionwill subsequently be described. The epoxy resin contained in the flameretardant epoxy resin material can be obtained byglycidyl-etherification of the phenol hydroxyl groups of the flameretardant phenol resin materials with use of any compounds which are notlimited but allow glycidyl-etherification. For example, epihalohydrinsuch as epichlorohydrin. Glycidyl-etherification of substantially allparts of the phenolic hydroxyl groups makes it easy to produce the resincomposition which is superior in thermal stability or thermaldecomposition resistance and the moisture resistance. Other method thanthe glycidyl-etherification, for example, epoxidation to the phenolichydroxyl group of the flame retardant resin material may be available byuse of other compound including epoxy group.

[0150] In order for the glycidyl-etherification of the phenolic hydroxylgroups, it is possible that the phenol condensate is solved and mixedwith an excess epihalohydrin such as epichlorohydrin and epibromehydrineand then an alkali metal hydroxide such as potassium hydroxide beforeand concurrently a reaction is caused at 20-120° C. for 1-10 hours.

[0151] The alkali metal hydroxide may be used in liquid state. In thiscase, the alkali metal hydroxide solution is continuously added into thereaction system and concurrently water and epihalohydrin arecontinuously removed under low pressure or atmospheric pressure prior tofurther separation to remove water whilst to return epihalohydrin to thereaction system.

[0152] A solution mixture of the phenol condensate and epihalohydrin maybe added with a catalyst of quaternary ammonium salt such astetramethylammoniumchloride, tetramethylammoniumbromide, andtrimethylbenzylammoniumchloride for causing a reaction at 50-150° C. for1-5 hours to obtain a halohydrin ether before a solid or a liquid of thealkali metal hydroxide is then added to cause a further reaction at20-120° C. for 1-10 hours to form dehydrohalogenation. A molar ratio inuse of the quaternary ammonium salt to hydroxyl groups of the phenolcondensate of the present invention is normally 1-10 g, preferably 2-8g.

[0153] Normally, a molar ratio in use of epihalohydrin to the hydroxylgroups of the phenol condensate of the present invention is normally1-20 mol, preferably 2-10 mol. A molar ratio in use of alkali metalhydroxide to the hydroxyl groups of the phenol condensate of the presentinvention is normally 0.8-1.5 mol, preferably 0.9-1.1 mol. In order topromote the reaction, it is also possible to add alcohols such asmethanol and ethanol, aprotic polar solvents dimethylsulfone anddimethylsulfoxide. An amount in use of alcohols to epihalohydrin isnormally 2-20% by weight, preferably 4-15% by weight. An amount in useof aprotic polar solvents to epihalohydrin is normally 5-100% by weight,preferably 10-90% by weight.

[0154] Either after the reacted product of the glycidyl-etherificationis cleaned with water or without water cleaning, epihalohydrin and theused solvents are removed at 110-250° C. under pressure of not higherthan 10 mmHg. In order to obtain the epoxy resin with reduced hydrolytichalogen, the epoxy resin is dissolved into a solvent such as toluene andmethylisobutylketone and then an alkali metal hydroxide such as sodiumhydroxide and potassium hydroxide to cause a ring-closing reaction. Inthis case, a molar ratio in use of alkali metal hydroxide to thehydroxyl groups of the phenol condensate of the present invention usedfor the glycidyl-etherification is normally 0.01-0.3 mol, preferably0.05-0.2 mol. A reaction temperature is normally 50-120° C., and thereaction time is 0.5-2 hours.

[0155] After the reaction, the salt is removed with filtration or watercleaning before the solvent such as toluene and isobutylketone is thenremoved to obtain the epoxy resin having the flame retardant epoxy resinmaterial of the present invention.

[0156] Some examples of the above epoxy resins are represented by thefollowing general formulae (31)-(42).

[0157] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0158] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0159] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0160] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0161] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0162] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0163] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0164] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0165] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0166] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0167] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m/i” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0168] where G is glycidyl group, R8 is any one of phenyl groups, alkylgroups of 1-12 carbon atoms, amino groups, hydroxyl groups,hydroxylalkyl groups, ether groups, ester groups, carboxyl groups,unsaturated hydrocarbon groups, thiol groups, and cyano groups, and “n”is 0.0-10, preferably 0.0-3.0, more preferably 0.0-1.0, and “m” is1.0-10, preferably 1.0-5.0, more preferably 1.0-2.0.

[0169] The flame retardant resin material including the epoxy resin maybe used for the frame retardant to the resin composition or the basematerial of the epoxy resin composition in combination with other phenolresins or amine compounds. The available epoxy resins in combination arenot limited but may, for example, be phenolbiphenylaralkyl epoxy resins,phenolphenylenearalkyl epoxy resins, phenoldiphenyletheraralkyl resins,naphthalene-containing epoxy resins such as naphtholaralkyl epoxyresins, phenoltriazine resins, phenolanthracenearalkyl epoxy resins,bisphenol fluorene epoxy resins, phenoltriazine epoxy resins, at leastone or combination of biphenyl-4,4′-diglycidylether, and3,3′,5,5′-tetramethyl biphenyl-4,4′-diglycidylether, tetraphenyrolethaneepoxy resins, trisphenyrolethane epoxy resins, phenol novolak epoxyresins, cresol novolak epoxy resins, bis-phenol A epoxy resin,bis-phenol F epoxy resin, bis-phenol S epoxy resin, polyphenol epoxyresin, aliphatic ester epoxy resin, cyclic aliphatic ester epoxy resin,and ether ester epoxy resin. Available amine compounds in combinationare not limited but may, for example, be glycidyl amine compounds suchas diamino diphenylmethane, diethylene triamine, anddiaminodiphenylsulfone. Those epoxy resins may be used alone or incombination. Phenolbiphenylaralkyl epoxy resins, phenolphenylenearalkylepoxy resins, phenoldiphenyletheraralkyl epoxy resins, andnaphtholaralkyl epoxy resins are particularly preferable.

[0170] A weight-average molecular weight of the phenol condensateincluded in the flame retardant phenol resin material of the presentinvention is not limited but may, for example, be 300-10000. Aweight-average molecular weight of the epoxy resin included in the flameretardant epoxy resin material of the present invention is not limitedbut may, for example, be 300-10000.

[0171] It is preferable that the flame retardant resin material of thepresent invention is substantially free of unreacted formaldehydes andmethylol groups to improve mixing stability with the epoxy resin orthermosetting agent in use as the base material or thermosetting agent.

[0172] An unreacted unifunctional phenol monomer included in the flameretardant resin material of the present invention is preferably not morethan 3% by weight in order to improve the mixing stability andparticularly improve thermal stability and moisture resistance of theepoxy resin composition.

[0173] The unreacted unifunctional phenol monomer means a phenol monomerincluding only one phenolic hydroxyl group which may be reacted withepoxy groups.

[0174] The flame retardant resin composition of the present inventionincludes the flame retardant phenol resin material and/or the flameretardant epoxy resin material. It is possible to add those resinmaterials alone or in combination. It is also possible to prepare amixture of flame retardant phenol resin material and the flame retardantepoxy resin material to add the mixture. It is also possible to preparea mixture of flame retardant phenol resin material and the flameretardant epoxy resin material for subsequent semi-thermosetting andthermosetting the mixture and then grinding the same for adding thepowders.

[0175] In accordance with the present invention, a total content (X) ofthe phenol condensate and the epoxy resin obtained by theglycidyl-etherification of the phenol condensate is preferably in therange of 0.1% by weight to 45% by weight, particularly preferable 0.3%by weight to 30% by weight, where X=(b/a)100, “a” is a total weight ofthe resin component of the resin composition, “b” is a total weight ofthe phenol condensate and the epoxy resin obtained by theglycidyl-etherification of the phenol condensate.

[0176] If the total weight is less than 0.1% by weight, then an amountof flame reducing gas of nitrogen based gas is insufficient for reducingthe fire or flame. If the total weight is less than 45% by weight, it ispossible that the obtained flame retardancy is insufficient, and alsopossible that a concentration of the heterocyclic compound havingnitrogen as heteroatom in the resin composition is so high as reducingthe moisture resistance.

[0177] The epoxy resin and the thermosetting agent for the epoxy resinmay be contained in the flame retardant resin composition of the presentinvention. A ratio (OH/Ep) of a total number (Ep) of epoxy groups in theepoxy resin to a total number (OH) of hydroxyl groups in thethermosetting agent is preferably in the range of 0.7 to 2.5 in order toimprove the flame retardancy of the resin. If the ratio (OH/Ep) is lessthan 0.7, then a generated amount of a flammable component such asallylalcohol is increased due to residual epoxy resin residing on abridge structure which has been formed by the thermosetting agent andthe epoxy resin, thereby preventing improvement in the flame retardancy.If the ratio (OH/Ep) is more than 2.5, then the bridge density is toolow to harden the epoxy resin composition, whereby the thermal stabilityand the solidity are insufficient.

[0178] The flame retardant resin composition of the present inventionmay optionally include various additives such as filler and hardeningpromoter.

[0179] Available fillers are not limited but may, for example, be fusedsilica powders, crystal silica powders, alumina powders, siliconnitride, glass fibers, carbon fibers, and aramid fibers or aromaticpolyamide fibers. Those fillers may be used alone or in mixture.

[0180] Available hardening promoters may be promoters for hardening theepoxy resin and the hardening agent, for example, triphenyl phosphine,2-methylimidazol, and 1,8-diazabicyclo(5,4,0)undecyne-7. Those hardeningpromoters may be used alone or in mixture.

[0181] Other available additives may, for example, be coloring materialssuch as carbon black, silane coupling agents such as γ-glycidexypropyltrimethoxysilane, low stress components such as silicone oils andsilicone rubbers, natural waxes, synthetic waxes, higher fatty acids,and metal salts thereof, mold release agents such as paraffin. Further,if any, other flame retardants may be co-used which comprises at leastone selected from the groups of phosphorus compounds such as redphosphorus and ester phosphate, metal hydroxide such as magnesium,aluminum, zinc, boron, calcium, nickel, cobalt, tin, copper, iron, andtitanium.

[0182] The metal oxides may be co-used provided that the flameretardancy is improved by co-use of the metal oxide and the resinmaterial. A composite metal hydroxide of the metal hydroxide and themetal oxide may be used to improve the flame retardancy. The necessaryamount in addition of the above flame retardant is small because theflame retardant includes the flame retardant phenol resin martial and/orthe flame retardant epoxy resin martial, whereby any deterioration inmoisture resistance and other properties are suppressed.

[0183] The thermosetting resin composition including the flame retardantresin material of the present invention may be produced by previouslyadmixing by ribbon blender or Henschel mixer and subsequent mixing withuse of heating roller or kneader or subsequent dissolving the same intoan organic solvent. After the organic solvent and moisture are if anyremoved before a transfer molding press or a heating press is used underpredetermined conditions to heat the resin composition so as to cause abridge reaction for hardening the resin composition, whereby the hardresin composition having a high flame retardancy can be obtained.

[0184] Semiconductor devices using the sealing material of the epoxyresin composition including the flame retardant resin material of thepresent invention are also superior in high flame retardancy, thermalstability or thermal decomposition resistance and moisture resistance.For example, a semiconductor device is mounted on a die pad of a leadframe for wire-bonding before sealing the semiconductor device with aresin composition including the flame retardant resin material of thepresent invention. The above epoxy resin composition may be applied to alead on chip resin-sealed semiconductor device, and a ball grid arrayresin-sealed semiconductor device. The above epoxy resin composition mayalso be applied to the sealing resin for various types of electric andelectronic devices including semiconductor devices.

[0185] The above epoxy resin composition including the flame retardantresin material of the present invention may be used as an insulator fora printed wiring board including glass fibers for improvements in flameretardancy, thermal stability or thermal decomposition resistance andmoisture resistance. The above epoxy resin composition including theflame retardant resin material of the present invention may further beused as molding materials, cast materials, adhesives, coloring materialsfor improvements in flame retardancy, thermal stability or thermaldecomposition resistance and moisture resistance.

[0186] The above thermoplastic resin composition including the flameretardant resin material of the present invention may be produced byextruders such as a uniaxial extruder, a biaxial extruder, a stonegrinder type extruder. After the moisture is if any removed before aninjection molding machine or a heating press is used under predeterminedconditions to form the thermoplastic resin composition having a highflame retardancy.

[0187] Examples of the present invention and comparative examples willhereinafter be described, wherein a filler is used which comprises amolten spherical silica particles which has an average particle diameterof 16 micrometers and a specific surface area of 1.9 m²/g measured byBET method, wherein particles having diameters of not less than 75micrometers are 0.5% by weight.

[0188] Silane coupling agent is used which comprisesN-phenyl-γ-aminopropyltrimethoxysilane (KBM573) which is commerciallyavailable from Shin-Etsu Chemical Industries Co.

EXAMPLE 1

[0189] A flask was attached with a temperature gage, a dripping funnel,a cooling tube, a fractionating column and a stirrer. 99 parts by weight(1.05 mol) of phenol and 121 parts by weight (0.5 mol) of a compoundrepresented by the following general formula (43) were entered into theflask. At room temperature, a stirring is made with nitrogen blowing.0.5 parts by weight (0.0026 mol) of p-toluene sulfonic acid (1-hydrate)was gradually added into the flask with attention to heat generation andwithout rising temperature of the solution to over 50° C. In oil bath, aheating was made to rise the temperature up to 120° C. so that, by useof the fractionating column, methanol was extracted before a reaction isallowed for 5 hours. After the reaction, 500 ml of methylisobutylketonewas added and then an organic layer was transferred into a separatingfunnel for subsequent water cleaning which is continued until thecleaning solution becomes neutral. The used solvent and unreactedunifunctional phenol were removed from the organic layer with heatingand under a low pressure, thereby obtaining a condensate (E) representedby the following formula (44).

[0190] where “n” is 0.0 to 1.0.

EXAMPLE 2

[0191] 81.3 parts by weight (0.22 mol) of the condensate (E) obtained inExample 1 was added with 26.4 parts by weight (0.22 mol) of melamine,8.1 parts by weight (0.11 mol) of 41.5 wt. %-formaldehyde solution and0.2 parts by weight (0.01 mol) of 25 wt. %-ammonium solution forgradually rising the temperature up to 100° C. with attention to heatgeneration. A reaction was made at 100° C. for 5 hours before furtherrising the temperature up to 180° C. for 2 hours under an atmosphericpressure with water removal. Subsequently, unreacted substances werethen removed under a low pressure to obtain a phenol condensate (P1)having a nitrogen content of 8% by weight and a hydroxyl groupsequivalent of 252 as well as having a softening point of 95° C. Theobtained phenol condensate (P1) is represented in the following generalformula (45).

[0192] where “n” is 0.0 to 1.0, and “m” is 1.0 to 2.0.

EXAMPLE 3

[0193] 25 parts by weight (0.05 mol) of the phenol condensate (P1)obtained in Example 2 was added with 50 parts by weight (0.54 mol) ofepichlorohydrin to rise the temperature up to 105° C. for dissolutionthereof. Further, 20 parts by weight (0.1 mol) of 20 wt. %-sodiumhydroxide solution was dropped for 3 hours for placing the solutionstatically for 30 minutes to cause a static separation before a lowerlayer or a water layer was removed.

[0194] Subsequently, the excess epichlorohydrin was distillated andrecycled. 20 parts by weight (2 mol) of methylisobutylketone was addedand dissolved. 0.5 parts by weight (0.0025 mol) of 20 wt. %-sodiumhydroxide solution was added for placing the solution at 70° C. for 3hours to cause a static separation before a lower layer or a water layerwas removed. The reminder was then cleaned with 200 parts by weight of adistilled water. A volatile component was removed by distillation toobtain an epoxy resin (EP1) having a nitrogen content of 6% by weightand an epoxy equivalent of 308 as well as having a softening point of75° C. and including hydrolytic chlorine of not more than 400 ppm. Theobtained epoxy resin (EP1) is represented in the following generalformula (46).

[0195] where “n” is 0.0 to 1.0, and “m” is 1.0 to 2.0.

EXAMPLE 4

[0196] A flask was attached with a temperature gage, a dripping funnel,a cooling tube, a fractionating column and a stirrer. 99 parts by weight(1.05 mol) of phenol and 83 parts by weight (0.5 mol) of a compoundrepresented by the following general formula (47) were entered into theflask. At room temperature, a stirring is made with nitrogen blowing.0.5 parts by weight (0.0026 mol) of p-toluene sulfonic acid (1-hydrate)was gradually added into the flask with attention to heat generation andwithout rising temperature of the solution to over 50° C. In oil bath, aheating was made to rise the temperature up to 120° C. so that, by useof the fractionating column, methanol was extracted before a reaction isallowed for 5 hours. After the reaction, 500 ml of methylisobutylketonewas added and then an organic layer was transferred into a separatingfunnel for subsequent water cleaning which is continued until thecleaning solution becomes neutral. The used solvent and unreactedunifunctional phenol were removed from the organic layer with heatingand under a low pressure, thereby obtaining a condensate (F) representedby the following formula (48).

[0197] where “n” is 0.0 to 1.0.

EXAMPLE 5

[0198] 63.8 parts by weight (0.22 mol) of the condensate (F) obtained inExample 4 was added with 26.4 parts by weight (0.22 mol) of melamine,8.1 parts by weight (0.11 mol) of 41.5 wt. %-formaldehyde solution and0.2 parts by weight (0.01 mol) of 25 wt. %-ammonium solution forgradually rising the temperature up to 100° C. with attention to heatgeneration. A reaction was made at 100° C. for 5 hours before furtherrising the temperature up to 180° C. for 2 hours under an atmosphericpressure with water removal. Subsequently, unreacted substances werethen removed under a low pressure to obtain a phenol condensate (P2)having a nitrogen content of 8% by weight and a hydroxyl groupequivalent of 245 as well as having a softening point of 92° C. Theobtained phenol condensate (P2) is represented in the following generalformula (49).

[0199] where “n” is 0.0 to 1.0, and “m” is 1.0 to 2.0.

EXAMPLE 6

[0200]25 parts by weight (0.05 mol) of the phenol condensate (P2)obtained in Example 5 was added with 50 parts by weight (0.54 mol) ofepichlorohydrin to rise the temperature up to 105° C. for dissolutionthereof. Further, 20 parts by weight (0.1 mol) of 20 wt. %-sodiumhydroxide solution was dropped for 3 hours for placing the solutionstatically for 30 minutes to cause a static separation before a lowerlayer or a water layer was removed.

[0201] Subsequently, the excess epichlorohydrin was distillated andrecycled. 20 parts by weight (1.2 mol) of methylisobutylketone was addedand dissolved. 0.5 parts by weight (0.0025 mol) of 20 wt. %-sodiumhydroxide solution was added for placing the solution at 70° C. for 3hours to cause a static separation before a lower layer or a water layerwas removed. The reminder was then cleaned with 200 parts by weight of adistilled water. A volatile component was removed by distillation toobtain an epoxy resin (EP2) having a nitrogen content of 6% by weightand an epoxy equivalent of 270 as well as having a softening point of69° C. and including hydrolytic chlorine of not more than 400 ppm. Theobtained epoxy resin (EP2) is represented in the following generalformula (50).

[0202] where G is glycidyl group, “n” is 0.0 to 1.0, and “m” is 1.0 to2.0.

[0203] Epoxy resins and thermosetting agents used in the followingexamples and comparative examples are represented in the followinggeneral formulae (51) through (60) and thermoplastic resins used in thefollowing examples and comparative examples are shown.

[0204] (Phenolbiphenylaralkyl Epoxy Resin (Epoxy Resin 1))

[0205] where “G” is glycidyl groups, “n”=0.0 to 10, softening point is57° C., epoxy equivalent is 270.

[0206] (Phenolbiphenylaralkyl Resin (Phenol Resin 1))

[0207] where “n”=0.0 to 10, softening point is 120° C., hydroxyl groupequivalent is 208.

[0208] (Phenolphenylenearalkyl Epoxy Resin (Epoxy Resin 2))

[0209] where “G” is glycidyl groups, “n”=0.0 to 10, softening point is55° C., epoxy equivalent is 238.

[0210] (Phenolphenylenearalkyl Resin (Phenol Resin 2))

[0211] where “n”=0.0 to 10, softening point is 83° C., hydroxyl groupequivalent is 175.

[0212] (2-Functional Biphenyl Epoxy Resin (Epoxy Resin 3))

[0213] where melting point is 111° C., epoxy equivalent is 170.

[0214] (Cresol Novolak Epoxy Resin (Epoxy Resin 4))

[0215] where “n”=0.0 to 10, softening point is 68° C., epoxy equivalentis 194.

[0216] (Phenoltriazine Epoxy Resin)

[0217] where “G” is glycidyl groups, “n”=0.0 to 10, “m”=1.0 to 10,softening point is 65° C., epoxy equivalent is 220, nitrogen content is6% by weight.

[0218] (Phenoltriazine Resin)

[0219] where “n”=0.0 to 10, “m”=1.0 to 10, softening point is 90° C.,hydroxyl group equivalent is 124, nitrogen content is 8% by weight.

[0220] (Phenol Benzoguanamine Resin)

[0221] where “n”=0.0 to 10, “m”=1.0 to 10, softening point is 105° C.,hydroxyl group equivalent is 220, nitrogen content is 19% by weight.

[0222] (Phenol Benzoguanamine Epoxy Resin)

[0223] where “G” is glycidyl groups, “n”=0.0 to 10, “m”=1.0 to 10,softening point is 80° C., epoxy equivalent is 276, nitrogen content is15% by weight.

[0224] (Thermoplastic Resin Composition 1)

[0225] acrylonitrile butadiene styrene copolymer: Sumitomo Chemical A &L GA-704, hereinafter referred to as “ABS”.

[0226] (Thermoplastic Resin Composition 2)

[0227] polystyrene resin: Shin-Nitetsu Sumitomo Chemical H-65,hereinafter referred to as “PS”.

EXAMPLE 7

[0228] At ordinary temperature, there were previously admixed 11.2 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 7.5parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of the above phenol condensate (P1) obtained in Example 2, 79.0%by weight of fused spherical silica powders, 0.4% by weight of carbonblack, 0.1% by weight of silane coupling agent, 0.2% by weight ofcarnauba wax, 0.2% by weight of triphenyl phosphine (T.T.P). Thereafter,the admixture was made on a roll of 100° C. for about 5 minutes and thenthe mixture was cooled and crushed to form the resin composition.

[0229] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 8

[0230] At ordinary temperature, there were previously admixed 10.0 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 8.7parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of the above epoxy resin (EP1) obtained in Example 3, 79.0% byweight of fused spherical silica powders, 0.4% by weight of carbonblack, 0.1% by weight of silane coupling agent, 0.2% by weight ofcarnauba wax, 0.2% by weight of triphenyl phosphine (T.T.P). Thereafter,the admixture was made on a roll of 100° C. for about 5 minutes and thenthe mixture was cooled and crushed to form the resin composition.

[0231] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 9

[0232] At ordinary temperature, there were previously admixed 5.99 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 4.94parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.17%by weight of the above phenol resin (P1) obtained in Example 2, 88.4% byweight of fused spherical silica powders, 0.2% by weight of carbonblack, 0.1% by weight of silane coupling agent, 0.1% by weight ofcarnauba wax, 0.1% by weight of triphenyl phosphine (T.T.P). Thereafter,the admixture was made on a roll of 100° C. for about 5 minutes and thenthe mixture was cooled and crushed to form the resin composition.

[0233] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 10

[0234] At ordinary temperature, there were previously admixed 11.2 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 7.5parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of the above phenol condensate (P2), 79.0% by weight of fusedspherical silica powders, 0.4% by weight of carbon black, 0.1% by weightof silane coupling agent, 0.2% by weight of carnauba wax, 0.2% by weightof triphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0235] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 11

[0236] At ordinary temperature, there were previously admixed 10.0 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 8.7parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of the above epoxy resin (EP2), 79.0% by weight of fusedspherical silica powders, 0.4% by weight of carbon black, 0.1% by weightof silane coupling agent, 0.2% by weight of carnauba wax, 0.2% by weightof triphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0237] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 12

[0238] At ordinary temperature, there were previously admixed 11.4 partsby weight of phenolphenylenearalkyl epoxy resin (epoxy resin 2), 7.3parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 1.4%by weight of the above phenol condensate (P2), 79.0% by weight of fusedspherical silica powders, 0.4% by weight of carbon black, 0.1% by weightof silane coupling agent, 0.2% by weight of carnauba wax, 0.2% by weightof triphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0239] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

EXAMPLE 13

[0240] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 10.0% by weight of the above phenol condensate(P1), 89.5% by weight of the above ABS (thermoplastic resin 1), 0.5% byweight of polytetrafluoroethylene (PTFE) to form a resin composition.This resin composition was dried at 120° C. for 3 hours beforepress-molding is carried out at 200° C. for 1 minute to form a flatplate having a thickness of 3.2 millimeters.

EXAMPLE 14

[0241] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 10.0% by weight of the above phenol condensate(P1), 89.5% by weight of the above PS (thermoplastic resin 2), 0.5% byweight of polytetrafluoroethylene (PTFE) to form a resin composition.This resin composition was dried at 120° C. for 3 hours beforepress-molding is carried out at 200° C. for 1 minute to form a flatplate having a thickness of 3.2 millimeters.

[0242] The molded test plates obtained in Examples 7-14 were evaluatedon flame retardancy, a boiled water absorption coefficient, a thermalstability and a moisture resistance.

[0243] Flame Retardancy Examination:

[0244] The sample plate has a size of 127 mm in length, 12.7 in widthand 1.6 or 3.2 mm in thickness. The plate was held by a sample holder(clamp) so that a longitudinal direction of the plate is vertical to theground. An opposite edge of the plate to the clamp was exposed to aflame by a burner for 10 seconds before the burner was made far from theplate so as to measure a after-flame time during which the flame resideson the plate after the burner had been made far from the plate (firstafter-flame time=F1). After the flame had disappeared, then the platewas again exposed to a flame by the burner for 10 seconds before theburner was made far from the plate so as to measure a after-flame time(second after-flame time=F2). This examination was made to five samplesof each type of the plates for evaluation on the flame retardancy. Thereare four flame retardancy criterions.

[0245] Highest Criterion (UL94 V-0)

[0246] ΣF≦50 seconds (ΣF=total time of individual after-flame times offive plates)/Fmax≦10 seconds (Fmax=longest one of two after-flame timesF1 and F2./No drip (drip=drip of a melt part of the plate due toflame)/Flame does not reach the clamp.

[0247] High Criterion (UL94 V-1)

[0248] ΣF≦250 seconds (ΣF=total time of individual after-flame times offive plates)/Fmax≦30 seconds (Fmax=longest one of two after-flame timesF1 and F2./No drip (drip=drip of a melt part of the plate due toflame)/Flame does not reach the clamp.

[0249] Low Criterion (UL94 V-2)

[0250] ΣF≦250 seconds (ΣF=total time of individual after-flame times offive plates)/Fmax≦30 seconds (Fmax=longest one of two after-flame timesF1 and F2./drip (drip=drip of a melt part of the plate due toflame)/Flame does not reach the clamp.

[0251] Lowest Criterion (UL94 V-2)

[0252] ΣF>250 seconds (ΣF=total time of individual after-flame times offive plates)/Fmax>30 seconds (Fmax=longest one of two after-flame timesF1 and F2./Drip (drip =drip of a melt part of the plate due toflame)/Flame does reach the clamp.

[0253] Boiled Water Absorption Coefficient Examination:

[0254] The resin composition in Example 7 were formed in a disk-shape of50 millimeters in diameter and 3 millimeters in thickness. Thedisk-shaped resin composition was dipped into a boiled water at 100° C.for 24 hours. The boiled water absorption coefficient (% by weight) wasfound on the basis of variation in weight of the disk-shaped resincomposition between after and before the disk-shaped resin compositionwas dipped into the boiled water. Results of evaluations on the boiledwater absorption coefficient are shown on below Table 1.

[0255] Thermal Stability (Thermal Decomposition Resistance) Examination:

[0256] The plate of the flame retardation test of Example 7 was crushedto form 10 g of powders of 80 micrometers in powder size. The powder washeated at a temperature rising rate of 200° C./min in an air with a flowrate of 200 ml/min. When 5 wt. % reduction was confirmed, thetemperature was measured. Results of evaluations on the thermalstability are shown on below Table 1.

[0257] Moisture Resistance Examination:

[0258] A silicon chip of 3.0 millimeters in longitudinal length, 3.5millimeters in horizontal length and 3.5 millimeters in thickness wasprepared, wherein aluminum wirings with a width of 10 micrometers areprovided at a pitch of 10 micrometers, and the aluminum wirings haveexpanding square parts of 70 micrometers squares on pads. The chip wasmounted on a 16 pins DIP 42-aloy frame so that gold wirings of 20micrometers were wire-bonded directly on the pads of the chip.Thereafter, the single plunger type transfer molding machine was used toseal the chip with the above tablet of Example 7 under conditions ofprevious heat temperature of 85° C., injection time of 15 seconds,injection pressure (effective pressure) of 100 kg/cm², moldingtemperature of 175° C., molding time of 120 seconds, thereby forming a16 pins DIP type semiconductor device of 18 millimeters in longitudinallength, 5 millimeters in horizontal length and 3 millimeters inthickness. The semiconductor device was then subjected to thethermosetting process at 175° C. for 4 hours to form the moistureresistance test sample.

[0259] Tens of the above semiconductor device were subjected to apressure cooker bias test (PCBT) under condition of 20V voltageapplication. When open defective rate becomes 20% or two semiconductordevices become defective, the time was measured as index of the moistureresistance. Long defective generation time means high moistureresistance. Results of evaluations on the moisture resistance are shownon below Table 1. TABLE 1 Ex.7 Ex.8 Ex.9 Ex.10 Ex.11 Ex.12 Ex.13 Ex.14phenolbiphenylaralkyl epoxy resin (epoxy resin 1) 11.2 10.0 5.99 11.2 10— — — phenolbiphenylaralkyl resin (phenol resin 1) 7.5 8.7 4.94 7.5 8.7— — — phenolphenylenearalkyl epoxy resin (epoxy resin 2) — — — — — 11.4— — phenolphenylenearalkyl resin (phenol resin 2) — — — — — 7.3 — —2-functional biphenyl epoxy resin (epoxy resin 3) — — — — — — — — cresolnovolak epoxy resin (epoxy resin 4) — — — — — — — —phenolbiphenyltriazine epoxy resin — 1.4 — — — — — — (epoxy resin(PE1).N6wt. %) (7.0/0.56) phenolbiphenyltriazine resin 1.4 — 1.7 — — —10.0 10.0 (phenol condensate (P1),N8wt. %) (7.0/0.56) (1.5/0.12)(10/0.8) (10/0.8) phenolphenylenetriazine epoxy resin — — — — 1.4 — — —(epoxy resin (PE2).N6wt. %) (7.0/0.42) phenolphenylenetriazine resin — —— 1.4 — 1.4 — — (phenol condensate (P2).N8wt. %) (7.0/0.56) (7.0/0.56)phenolbiphenylbenzoguanamine epoxy resin — — — — — — — — (epoxy resin(PE3),N9wt. %) phenolbiphenylbenzoguanamine resin — — — — — — — —(phenol condensate (P3).N10wt. %) phenolphenylenebenzoguanamine epoxyresin — — — — — — — — (epoxy resin (PE4).N8wt, %)phenolphenylenebenzoguanamine resin — — — — — — — — (phenol condensate(P4).N10wt. %) phenoltriazine epoxy resin (N6wt. %) — — — — — — — —phenoltriazine resin (N8wt. %) — — — — — — — — phenolbenzoguanamineepoxy resin (N15wt. %) — — — — — — — — phenolbenzoguanamine resin(N19wt. %) — — — — — — — — ABS (thermoplastic resin 1) — — — — — — 89.5— PS (thermoplastic resin 2) — — — — — — — 89.5 fused spherical silica79.0 79.0 88.4 79.0 79.0 79.0 — — carbon black 0.4 0.4 0.2 0.4 0.4 0.4 —— silane coupling agent 0.1 0.1 0.1 0.1 0.1 0.1 — — carnauba wax 0.2 0.20.1 0.2 0.2 0.2 — — triphenylphosphine (T.P.P.) 0.2 0.2 0.1 0.2 0.2 0.2— — polytetorafluoroethylene (PTFE) — — — — — — 0.5 0.5 UL94 criterionV-0 V-0 V-0 V-0 V-0 V-0 V-1 V-1 (total time of after-flame times) 7 9 2015 16 19 105 130 boiled water absorption coefficient par 24 hours 0.190.19 0.13 0.20 0.21 0.22 un- un- % by weight examined examined thermaldecomposition resistance 610 604 725 600 595 580 un- un- (temperature at5wt. % reduction) ° C. examined examined moisture-resistance (timeperiod for 450 450 470 440 440 430 un- un- 20% defects) Time examinedexamined

COMPARATIVE EXAMPLE 1

[0260] At ordinary temperature, there were previously admixed 11.9 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 6.8parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of phenoltriazine resin having nitrogen content of 8% by weight,79.0% by weight of fused spherical silica powders, 0.4% by weight ofcarbon black, 0.1% by weight of silane coupling agent, 0.2% by weight ofcarnauba wax, 0.2% by weight of triphenyl phosphine (T.T.P). Thereafter,the admixture was made on a roll of 100° C. for about 5 minutes and thenthe mixture was cooled and crushed to form the resin composition.

[0261] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0262] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 2

[0263] At ordinary temperature, there were previously admixed 9.8 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 8.9parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.4% byweight of phenoltriazine epoxy resin having nitrogen content of 6% byweight, 79.0% by weight of fused spherical silica powders, 0.4% byweight of carbon black, 0.1% by weight of silane coupling agent, 0.2% byweight of carnauba wax, 0.2% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0264] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0265] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 3

[0266] At ordinary temperature, there were previously admixed 6.07 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 4.86parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 0.17%by weight of phenoltriazine resin having nitrogen content of 8% byweight, 88.4% by weight of fused spherical silica powders, 0.2% byweight of carbon black, 0.1% by weight of silane coupling agent, 0.1% byweight of carnauba wax, 0.1% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0267] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0268] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 4

[0269] At ordinary temperature, there were previously admixed 6.0 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 5.1parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 88.4%by weight of fused spherical silica powders, 0.2% by weight of carbonblack, 0.1% by weight of silane coupling agent, 0.1% by weight ofcarnauba wax, 0.1% by weight of triphenyl phosphine (T.T.P). Thereafter,the admixture was made on a roll of 100° C. for about 5 minutes and thenthe mixture was cooled and crushed to form the resin composition.

[0270] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0271] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 5

[0272] At ordinary temperature, there were previously admixed 11.9 partsby weight of phenolphenylenearalkyl epoxy resin (epoxy resin 2), 6.8parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 1.4%by weight of phenoltriazine resin having nitrogen content of 8% byweight, 79.0% by weight of fused spherical silica powders, 0.4% byweight of carbon black, 0.1% by weight of silane coupling agent, 0.1% byweight of carnauba wax, 0.1% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0273] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm2, a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0274] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 6

[0275] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 99.5% by weight of the above ABS (thermoplasticresin 1), 0.5% by weight of polytetrafluoroethylene (PTFE) to form aresin composition. This resin composition was dried at 120° C. for 3hours before press-molding is carried out at 200° C. for 1 minute toform a flat plate having a thickness of 3.2 millimeters.

[0276] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 7

[0277] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 10.0% by weight of phenoltriazine resin havingnitrogen content of 8% by weight, 89.5% by weight of the above ABS(thermoplastic resin 1), 0.5% by weight of polytetrafluoroethylene(PTFE) to form a resin composition. This resin composition was dried at120° C. for 3 hours before press-molding is carried out at 200° C. for 1minute to form a flat plate having a thickness of 3.2 millimeters.

[0278] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2.

COMPARATIVE EXAMPLE 8

[0279] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 99.5% by weight of the above PS (thermoplasticresin 2), 0.5% by weight of polytetrafluoroethylene (PTFE) to form aresin composition. This resin composition was dried at 120° C. for 3hours before press-molding is carried out at 200° C. for 1 minute toform a flat plate having a thickness of 3.2 millimeters.

[0280] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 2. TABLE 2 Com.Ex.1Com.Ex.2 Com.Ex.3 Com.Ex.4 Com.Ex.5 Com.Ex.6 Com.Ex.7 Com.Ex.8phenolbiphenylaralkyl epoxy resin (epoxy resin 1) 11.9 9.8 6.07 6.0 — —— — phenolbiphenylaralkyl resin (phenol resin 1) 6.8 8.9 4.86 5.1 — — —— phenolphenylenearalkyl epoxy resin (epoxy resin 2) — — — — 11.9 — — —phenolphenylenearalkyl resin (phenol resin 2) — — — — 6.8 — — —2-functional biphenyl epoxy resin (epoxy resin 3) — — — — — — — — cresolnovolak epoxy resin (epoxy resin 4) — — — — — — — —phenolbiphenyltriazine epoxy resin — — — — — — (epoxy resin (PE1).N6wt.%) phenolbiphenyltriazine resin - — — — — — — — (phenol condensate(P1),N8wt. %) phenolphenylenetriazine epoxy resin — — — — — — — — (epoxyresin (PE2).N6wt. %) phenolphenylenetriazine resin — — — — — — — —(phenol condensate (P2).N8wt. %) phenolbiphenylbenzoguanamine epoxyresin — — — — — — — — (epoxy resin (PE3),N9wt. %)phenolbiphenylbenzoguanamine resin — — — — — — — — (phenol condensate(P3).N10wt. %) phenolphenylenebenzoguanamine epoxy resin — — — — — — — —(epoxy resin (PE4).N8wt, %) phenolphenylenebenzoguanamine resin — — — —— — — — (phenol condensate (P4).N10wt. %) phenoltriazine epoxy resin(N6wt. %) — 1.4 — — — — — — (7.0/0.42) phenoltriazine resin (N8wt. %)1.4 — 0.17 — 1.4 — 10.0 — (7.0/0.56) (1.5/0.12) (7.0/0.56) (10.0/0.8)phenolbenzoguanamine epoxy resin (N15wt. %) — — — — — — — —phenolbenzoguanamine resin (N19wt. %) — — — — — — — — ABS (thermoplasticresin 1) — — — — — 99.5 89.5 — PS (thermoplastic resin 2) — — — — — — —99.5 fused spherical silica 79.0 79.0 88.4 88.4 79.0 — — — carbon black0.4 0.4 0.2 0.4 0.4 — — — silane coupling agent 0.1 0.1 0.1 0.1 0.1 — —— carnauba wax 0.2 0.2 0.1 0.1 0.1 — — — triphenylphosphine (T.P.P.) 0.20.2 0.1 0.1 0.1 — — — polytetorafluoroethylene (PTFE) — — — — — 0.5 0.50.5 UL94 criterion V-0 V-0 V-0 V-0 V-0 NOT V-2 V-1 NOT V-2 (total timeof after-flame times) 29 31 37 43 34 >250 150 >250 boiled waterabsorption coefficient par 24 hours 0.25 0.26 0.18 0.12 0.29 un- un- un-% by weight examined examined examined thermal decomposition resistance563 550 670 660 545 un- un- un- (temperature at 5wt. % reduction) ° C.examined examined examined moisture-resistance (time period for 400 400410 460 385 un- un- un- 20% defects) Time examined examined examined

EXAMPLE 15

[0281]274.7 parts by weight (0.5 mol) of the condensate (E) obtained inExample 1 was added with 93.85 parts by weight (0.5 mol) ofbenzoguanamine, 52.7 parts by weight (0.65 mol) of 37 wt. %-formaldehydesolution and 0.879 parts by weight (0.015 mol) of 29 wt. %-ammoniumsolution for gradually rising the temperature up to 100° C. withattention to heat generation. A reaction was made at 100° C. for 5 hoursbefore further rising the temperature up to 180° C. for 2 hours under anatmospheric pressure with water removal. Subsequently, unreactedsubstances were then removed under a low pressure to obtain a phenolcondensate (P3) having a nitrogen content of 10% by weight and ahydroxyl groups equivalent of 260 as well as having a softening point of120° C. The obtained phenol condensate (P3) is represented in thefollowing general formula (61).

[0282] where “n” is 0.0 to 1.0, and “m” is 1.0 to 2.0.

EXAMPLE 16

[0283]25 parts by weight (0.05 mol) of the phenol condensate (P3)obtained in Example 15 was added with 50 parts by weight (0.54 mol) ofepichlorohydrin to rise the temperature up to 115° C. for dissolutionthereof. Further, 20 parts by weight (0.1 mol) of 20 wt. %-sodiumhydroxide solution was dropped for 3 hours for placing the solutionstatically for 30 minutes to cause a static separation before a lowerlayer or a water layer was removed.

[0284] Subsequently, the excess epichlorohydrin was distillated andrecycled. 20 parts by weight (2 mol) of methylisobutylketone was addedand dissolved. 0.5 parts by weight (0.0025 mol) of 20 wt. %-sodiumhydroxide solution was added for placing the solution at 70° C. for 3hours to cause a static separation before a lower layer or a water layerwas removed. The reminder was then cleaned with 200 parts by weight of adistilled water. A volatile component was removed by distillation toobtain an epoxy resin (EP3) having a nitrogen content of 9% by weightand an epoxy equivalent of 316 as well as having a softening point of80° C. and including hydrolytic chlorine of not more than 400 ppm. Theobtained epoxy resin (EP3) is represented in the following generalformula (62).

[0285] where G is glycidyl group, “n” is 0.0 to 1.0, and “m” is 1.0 to2.0.

EXAMPLE 17

[0286]403.4 parts by weight (0.5 mol) of the condensate (F) obtained inExample 4 was added with 93.85 parts by weight (0.5 mol) ofbenzoguanamine, 52.7 parts by weight (0.65 mol) of 37 wt. %-formaldehydesolution and 0.879 parts by weight (0.015 mol) of 29 wt. %-ammoniumsolution for gradually rising the temperature up to 100° C. withattention to heat generation. A reaction was made at 100° C. for 5 hoursbefore further rising the temperature up to 180° C. for 2 hours under anatmospheric pressure with water removal. Subsequently, unreactedsubstances were then removed under a low pressure to obtain a phenolcondensate (P4) having a nitrogen content of 10% by weight and ahydroxyl groups equivalent of 226 as well as having a softening point of110° C. The obtained phenol condensate (P4) is represented in thefollowing general formula (63).

[0287] where “n” is 0.0 to 1.0, and “m” is 1.0 to 2.0.

EXAMPLE 18

[0288]25 parts by weight (0.05 mol) of the phenol condensate (P4)obtained in Example 17 was added with 50 parts by weight (0.54 mol) ofepichlorohydrin to rise the temperature up to 115° C. for dissolutionthereof. Further, 20 parts by weight (0.1 mol) of 20 wt. %-sodiumhydroxide solution was dropped for 3 hours for placing the solutionstatically for 30 minutes to cause a static separation before a lowerlayer or a water layer was removed.

[0289] Subsequently, the excess epichlorohydrin was distillated andrecycled. 20 parts by weight (1.2 mol) of methylisobutylketone was addedand dissolved. 0.5 parts by weight (0.0025 mol) of 20 wt. %-sodiumhydroxide solution was added for placing the solution at 70° C. for 3hours to cause a static separation before a lower layer or a water layerwas removed. The reminder was then cleaned with 200 parts by weight of adistilled water. A volatile component was removed by distillation toobtain an epoxy resin (EP4) having a nitrogen content of 8% by weightand an epoxy equivalent of 284 as well as having a softening point of75° C. and including hydrolytic chlorine of not more than 400 ppm. Theobtained epoxy resin (EP4) is represented in the following generalformula (64).

[0290] where G is glycidyl group, “n” is 0.0 to 1.0, and “m” is 1.0 to2.0.

EXAMPLE 19

[0291] At ordinary temperature, there were previously admixed 11.23parts by weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1),7.74 parts by weight of phenolbiphenylaralkyl resin (phenol resin 1),1.13% by weight of the above phenol condensate (P3) having a nitrogencontent of 10% by weight, 79.0% by weight of fused spherical silicapowders, 0.4% by weight of carbon black, 0.1% by weight of silanecoupling agent, 0.2% by weight of carnauba wax, 0.2% by weight oftriphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0292] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0293] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 20

[0294] At ordinary temperature, there were previously admixed 10.47parts by weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1),8.69 parts by weight of phenolbiphenylaralkyl resin (phenol resin 1),0.94% by weight of the above epoxy resin (EP3) having a nitrogen contentof 9% by weight, 79.0% by weight of fused spherical silica powders, 0.4%by weight of carbon black, 0.1% by weight of silane coupling agent, 0.2%by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0295] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0296] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 21

[0297] At ordinary temperature, there were previously admixed 10.32parts by weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1),8.72 parts by weight of phenolbiphenylaralkyl resin (phenol resin 1),1.06% by weight of the above epoxy resin (EP4) having a nitrogen contentof 8% by weight, 79.0% by weight of fused spherical silica powders, 0.4%by weight of carbon black, 0.1% by weight of silane coupling agent, 0.2%by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0298] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0299] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 22

[0300] At ordinary temperature, there were previously admixed 11.43parts by weight of phenolphenylenearalkyl epoxy resin (epoxy resin 2),7.54 parts by weight of phenolphenylenearalkyl resin (phenol resin 2),1.13% by weight of the above phenol condensate (P4) having a nitrogencontent of 10% by weight, 79.0% by weight of fused spherical silicapowders, 0.4% by weight of carbon black, 0.1% by weight of silanecoupling agent, 0.2% by weight of carnauba wax, 0.2% by weight oftriphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0301] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0302] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 23

[0303] At ordinary temperature, there were previously admixed 8.94 partsby weight of 2-functional biphenyl epoxy resin (epoxy resin 3), 10.03parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 1.13%by weight of the above phenol condensate (P3) having a nitrogen contentof 10% by weight, 79.0% by weight of fused spherical silica powders,0.4% by weight of carbon black, 0.1% by weight of silane coupling agent,0.2% by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0304] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0305] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 24

[0306] At ordinary temperature, there were previously admixed 5.62 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 3.86parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 4.63parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 4.86parts by weight of 2-functional biphenyl epoxy resin (epoxy resin 3),1.13% by weight of the above phenol condensate (P3) having a nitrogencontent of 10% by weight, 79.0% by weight of fused spherical silicapowders, 0.4% by weight of carbon black, 0.1% by weight of silanecoupling agent, 0.2% by weight of carnauba wax, 0.2% by weight oftriphenyl phosphine (T.T.P). Thereafter, the admixture was made on aroll of 100° C. for about 5 minutes and then the mixture was cooled andcrushed to form the resin composition.

[0307] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0308] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 25

[0309] At ordinary temperature, there were previously admixed 5.61 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 3.87parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 4.30parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 5.19parts by weight of cresol novolak epoxy resin (epoxy resin 4), 1.13% byweight of the above phenol condensate (P3) having a nitrogen content of10% by weight, 79.0% by weight of fused spherical silica powders, 0.4%by weight of carbon black, 0.1% by weight of silane coupling agent, 0.2%by weight of camauba wax, 0.2% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0310] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0311] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 26

[0312] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 8.0% by weight of the above phenol condensate(P3) having a nitrogen content of 10% by weight, 91.5% by weight of theabove ABS (thermoplastic resin 1), 0.5% by weight ofpolytetrafluoroethylene (PTFE) to form a resin composition. This resincomposition was dried at 120° C. for 3 hours before press-molding iscarried out at 200° C. for 1 minute to form a flat plate having athickness of 3.2 millimeters.

[0313] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3.

EXAMPLE 27

[0314] At a temperature of 220° C., on a stone grinding extruder, therewere fused and admixed 8.0% by weight of the above phenol condensate(P3) having a nitrogen content of 10% by weight, 91.5% by weight of theabove PS (thermoplastic resin 2), 0.5% by weight ofpolytetrafluoroethylene (PTFE) to form a resin composition. This resincomposition was dried at 120° C. for 3 hours before press-molding iscarried out at 200° C. for 1 minute to form a flat plate having athickness of 3.2 millimeters.

[0315] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 3. TABLE 3 Ex.19 Ex.20Ex.21 Ex.22 Ex.23 Ex.24 Ex.25 Ex.28 Ex.27 phenolbiphenylaralkyl epoxyresin 11.23 10.47 10.32 — — 5.62 5.61 — — (epoxy resin 1)phenolbiphenylaralkyl resin (phenol resin 1) 7.74 8.69 8.72 — 10.03 3.863.87 — — phenolphenylenearalkyl epoxy resin — — — 11.43 — — — — — (epoxyresin 2) phenolphenylenearalkyl resin — — — 7.54 — 4.63 4.30 — — (phenolresin 2) 2-functional biphenyl epoxy resin — — — — 8.94 4.86 — — —(epoxy resin 3) cresol novolak epoxy resin (epoxy resin 4) — — — — — —5.19 — — phenolbiphenyltriazine epoxy resin — — — — — — — — — (epoxyresin (PE1).N6wt. %) phenolbiphenyltriazine resin — — — — — — — — —(phenol condensate (P1),N8wt. %) phenolphenylenetriazine epoxy resin — —— — — — — — — (epoxy resin (PE2).N6wt. %) phenolphenylenetriazine resin— — — — — — — — — (phenol condensate (P2).N8wt. %)phenolbiphenylbenzoguanamine epoxy resin — 0.04 — — — — — — — (epoxyresin (PE3),N9wt. %) (4.7/0.42) phenolbiphenylbenzoguanamine resin 1.13— — — 1.13 1.13 1.13 8.0 8.0 (phenol condensate (P3).N10wt. %)(5.6/0.56) (5.6/0.56) (5.6/0.56) (5.6/0.56) (8/0.8) (8/0.8)phenolphenylenebenzoguanamine — — 1.08 — — — — — — epoxy resin(5.3/0.42) (epoxy resin (PE4).N8wt, %) phenolphenylenebenzoguanamineresin — — — 1.13 — — — — (phenol condensate (P4).N10wt. %) (5.6/0.56)phenoltriazine epoxy resin (N6wt. %) — — — — — — — — — phenoltriazineresin (N8wt. %) — — — — — — — — — phenolbenzoguanamine epoxy resin — — —— — — — — — (N15wt. %) phenolbenzoguanamine resin (N19wt. %) — — — — — —— — — ABS (thermoplastic resin 1) — — — — — — — 91.5 — PS (thermoplasticresin 2) — — — — — — — — 91.5 fused spherical silica 79.0 79.0 79.0 79.079.0 79.0 79.0 — — carbon black 0.4 0.4 0.4 0.4 0.4 0.4 0.4 — — silanecoupling agent 0.1 0.1 0.1 0.1 0.1 0.1 0.1 — — carnauba wax 0.2 0.2 0.20.2 0.2 0.2 0.2 — — triphenylphosphine (T.P.P.) 0.2 0.2 0.2 0.2 0.2 0.20.2 — — polytetorafluoroethylene (PTFE) — — — — — — 0.5 0.5 UL94criterion V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-1 V-1 (total time of after-flametimes) 3 5 12 14 24 11 10 90 110 boiled water absorption coefficient par0.16 0.15 0.19 0.20 0.22 0.20 0.14 unexa- unexa- 24 hours % by weightmined mined thermal decomposition resistance 630 620 610 595 600 595625.0 unexa- unexa- (temperature at 5wt. % reduction) ° C. mined minedmoisture-resistance (time period for 460 460 450 450 430 440 470.0unexa- unexa- 20% defects) Time mined mined

COMPARATIVE EXAMPLE 9

[0316] At ordinary temperature, there were previously admixed 11.3 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 8.18parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 0.59%by weight of phenol benzoguanamine resin having a nitrogen content of19% by weight, 79.0% by weight of fused spherical silica powders, 0.4%by weight of carbon black, 0.1% by weight of silane coupling agent, 0.2%by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0317] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0318] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 10

[0319] At ordinary temperature, there were previously admixed 10.8 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 8.74parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 0.56%by weight of phenol benzoguanamine epoxy resin having a nitrogen contentof 15% by weight, 79.0% by weight of fused spherical silica powders,0.4% by weight of carbon black, 0.1% by weight of silane coupling agent,0.2% by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0320] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0321] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 11

[0322] At ordinary temperature, there were previously admixed 11.51parts by weight of phenolphenylenearalkyl epoxy resin (epoxy resin 2),8.00 parts by weight of phenolphenylenearalkyl resin (phenol resin 2),0.59% by weight of phenol benzoguanamine resin having a nitrogen contentof 19% by weight, 79.0% by weight of fused spherical silica powders,0.4% by weight of carbon black, 0.1% by weight of silane coupling agent,0.2% by weight of carnauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0323] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0324] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 12

[0325] At ordinary temperature, there were previously admixed 9.03 partsby weight of 2-functional biphenyl epoxy resin (epoxy resin 3), 10.48parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 0.59%by weight of phenol benzoguanamine resin having a nitrogen content of19% by weight, 79.0% by weight of fused spherical silica powders, 0.4%by weight of carbon black, 0.1% by weight of silane coupling agent, 0.2%by weight of camauba wax, 0.2% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0326] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0327] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 13

[0328] At ordinary temperature, there were previously admixed 5.72 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 4.30parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 4.63parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 4.86parts by weight of 2-functional biphenyl epoxy resin (epoxy resin 3),0.59% by weight of phenol benzoguanamine resin having a nitrogen contentof 19% by weight, 79.0% by weight of fused spherical silica powders,0.4% by weight of carbon black, 0.1% by weight of silane coupling agent,0.2% by weight of camauba wax, 0.2% by weight of triphenyl phosphine(T.T.P). Thereafter, the admixture was made on a roll of 100° C. forabout 5 minutes and then the mixture was cooled and crushed to form theresin composition.

[0329] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0330] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 14

[0331] At ordinary temperature, there were previously admixed 5.72 partsby weight of phenolbiphenylaralkyl epoxy resin (epoxy resin 1), 4.30parts by weight of phenolbiphenylaralkyl resin (phenol resin 1), 4.30parts by weight of phenolphenylenearalkyl resin (phenol resin 2), 5.19parts by weight of cresol novolak epoxy resin (epoxy resin 4), 0.59% byweight of phenol benzoguanamine resin having a nitrogen content of 19%by weight, 79.0% by weight of fused spherical silica powders, 0.4% byweight of carbon black, 0.1% by weight of silane coupling agent, 0.2% byweight of carnauba wax, 0.2% by weight of triphenyl phosphine (T.T.P).Thereafter, the admixture was made on a roll of 100° C. for about 5minutes and then the mixture was cooled and crushed to form the resincomposition.

[0332] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0333] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4.

COMPARATIVE EXAMPLE 15

[0334] At ordinary temperature, there were previously admixed 4.2% byweight of phenol benzoguanamine resin having a nitrogen content of 19%by weight, 95.3% by weight of the above PS (thermoplastic resin 2), 0.5%by weight of polytetrafluoroethylene (PTFE). Thereafter, the admixturewas made on a roll of 100° C. for about 5 minutes and then the mixturewas cooled and crushed to form the resin composition.

[0335] The resin composition was compressed to form a tablet. Thistablet was previously heated at 85° C. for subsequent molding by use ofa single plunger type transfer molding machine under conditions of aninjection time of 15 seconds, an injection pressure (effective pressure)of 100 kg/cm², a molding temperature of 175° C., a molding time of 120seconds in accordance with the UL94 flame retardation regulation.Subsequently, thermosetting process was carried out at 175° C. for 6hours to form a flame retardant test sample plate.

[0336] The molded test plates obtained in this comparative example wasevaluated on flame retardancy, a boiled water absorption coefficient, athermal stability and a moisture resistance. Results of evaluations onthe moisture resistance are shown on below Table 4. TABLE 4 Com. Com.Com. Com. Com. Com. Com.Ex.9 Ex.10 Ex.11 Ex.12 Ex.13 Ex.14 Ex.15phenolbiphenylaralkyl epoxy resin (epoxy resin 1) 11.3 10.8 — — 5.725.72 — phenolbiphenylaralkyl resin (phenol resin 1) 8.18 8.74 — 10.484.30 4.30 — phenolphenylenearalkyl epoxy resin (epoxy resin 2) — — 11.51— — — — phenolphenylenearalkyl resin (phenol resin 2) — — 8.00 — 4.634.30 — 2-functional biphenyl epoxy resin (epoxy resin 3) — — — 9.03 4.86— — cresol novolak epoxy resin (epoxy resin 4) — — — — — 5.19 —phenolbiphenyltriazine epoxy resin — — — — — — — (epoxy resin(PE1).N6wt. %) phenolbiphenyltriazine resin — — — — — — — (phenolcondensate (P1),N8wt. %) phenolphenylenetriazine epoxy resin — — — — — —— (epoxy resin (PE2).N6wt. %) phenolphenylenetriazine resin — — — — — —— (phenol condensate (P2).N8wt. %) phenolbiphenylbenzoguanamine epoxyresin — — — — — — — (epoxy resin (PE3),N9wt. %)phenolbiphenylbenzoguanamine resin — — — — — — (phenol condensate(P3).N10wt. %) phenolphenylenebenzoguanamine epoxy resin — — — — — — —(epoxy resin (PE4).N8wt, %) phenolphenylenebenzoguanamine resin — — — —— — — (phenol condensate (P4).N10wt. %) phenoltriazine epoxy resin(N6wt. %) — — — — — — — phenoltriazine resin (N8wt. %) — — — — — — —phenolbenzoguanamine epoxy resin (N15wt. %) — 0.56 — — — — — (2.8/0.42)phenolbenzoguanamine resin (N19wt. %) 0.59 — 0.59 0.59 0.59 0.59 0.42(2.9/0.56) (2.9/0.56) (2.9/0.56) (2.9/0.56) (2.9/0.56) (4.2/0.8) ABS(thermoplastic resin 1) — — — — — — — PS (thermoplastic resin 2) — — — —— — 9.53 fused spherical silica 0.4 0.4 0.4 0.4 0.4 0.4 — carbon black0.1 0.1 0.1 0.1 0.1 0.1 — silane coupling agent 0.2 0.2 0.2 0.2 0.2 0.2— carnauba wax 0.2 0.2 0.2 0.2 0.2 0.2 — triphenylphosphine (T.P.P.) 0.20.2 0.2 0.2 0.2 0.2 — polytetorafluoroethylene (PTFE) — — — — — — 0.5UL94 criterion V-0 V-0 V-0 V-0 V-0 V-0 V-1 (total time of after-flametimes) 26 28 30 44 31 30 180 boiled water absorption coefficient par 24hours 0.23 0.24 0.27 0.32 0.36 0.28 unexa- % by weight mined thermaldecomposition resistance 565 558 555 550 540 560 unexa- (temperature at5wt. % reduction) ° C. mined moisture-resistance (time period for 410410 395 380 380 400 unexa- 20% defects) Time mined

[0337] The novel resin compositions having the improved flame retardantresin materials in Examples 7, 8, 10, 11, 19-21 are superior in flameretardancy, thermal stability or thermal decomposition resistance,moisture resistance as compared to the conventional resin compositionshaving the conventional flame retardant resin materials in ComparativeExamples 1, 2, 9, 10.

[0338] The novel resin composition having the improved flame retardantresin material in Example 9 is superior in flame retardancy, thermalstability or thermal decomposition resistance, moisture resistance ascompared to the conventional resin compositions having the conventionalflame retardant resin materials in Comparative Examples 3, 4.

[0339] The novel resin compositions having the improved flame retardantresin materials in Examples 12, 22 are superior in flame retardancy,thermal stability or thermal decomposition resistance, moistureresistance as compared to the conventional resin compositions having theconventional flame retardant resin materials in Comparative Examples 5,11.

[0340] The novel resin composition having the improved flame retardantresin material in Example 23 is superior in flame retardancy, thermalstability or thermal decomposition resistance, moisture resistance ascompared to the conventional resin composition having the conventionalflame retardant resin material in Comparative Example 12.

[0341] The novel resin composition having the improved flame retardantresin material in Example 24 is superior in flame retardancy, thermalstability or thermal decomposition resistance, moisture resistance ascompared to the conventional resin composition having the conventionalflame retardant resin material in Comparative Example 13.

[0342] The novel resin composition having the improved flame retardantresin material in Example 25 is superior in flame retardancy, thermalstability or thermal decomposition resistance, moisture resistance ascompared to the conventional resin composition having the conventionalflame retardant resin material in Comparative Example 14.

[0343] The novel resin compositions having the improved flame retardantresin materials in Examples 13, 26 is superior in flame retardancy,thermal stability or thermal decomposition resistance, moistureresistance as compared to the conventional resin compositions having theconventional flame retardant resin materials in Comparative Examples 6,7.

[0344] The novel resin compositions having the improved flame retardantresin materials in Examples 14, 27 is superior in flame retardancy,thermal stability or thermal decomposition resistance, moistureresistance as compared to the conventional resin compositions having theconventional flame retardant resin materials in Comparative Examples 8,15.

[0345] The conventional resin compositions include the phenol resinshaving triazine rings on the molecular skeletons or include the epoxyresins having triazine rings on the molecular skeletons. The otherconventional resin compositions include both phenolbiphenylaralkyl epoxyresins having biphenyl groups on the molecular skeletons and the phenolresins having triazine rings on the molecular skeletons. The novel resincompositions include the flame retardant resin compositions having boththe triazine rings and the aromatic rings on the same molecularskeletons.

[0346] The novel resin compositions are superior in flame retardancy,thermal stability or thermal decomposition resistance and moistureresistance as compared to the conventional resin compositions.

[0347] Whereas modifications of the present invention will be apparentto a person having ordinary skill in the art, to which the inventionpertains, it is to be understood that embodiments as shown and describedby way of illustrations are by no means intended to be considered in alimiting sense. Accordingly, it is to be intended to cover by claims allmodifications which fall within the spirit and scope of the presentinvention.

What is claimed:
 1. The flame retardant phenol resin material,comprising: A phenol condensate, wherein a poly-aromatic compoundobtained be a condensation reaction of phenols (A) to aromatics (B)except for phenols and a heterocyclic compound (C) including nitrogen asa heteroatom are condensed via aldehydes (D), wherein said aromatics (B)are represented by the following chemical formula (1), XH₂C—R₁—CH₂X  (1)wherein R₁ is any one of biphenyl derivatives, phenylene derivatives,naphthalene derivatives, biphenylene derivatives, fluorine derivatives,bis-phenol fluorine derivatives, and X is any one of halogen atoms,hydroxyl groups and alkoxyl groups having not larger than 10 carbonatoms, wherein said flame retardant material further comprises at leasta flame retardant phenol resin material, and said flame retardantmaterial further comprises an aromatic thermosetting resin comprisingaromatic rings on a main chain skeleton.
 2. The flame retardant resincomposition as claimed in claim 1, wherein said aromatic thermosettingresin comprises an epoxy resin having a novolak structure.
 3. The flameretardant resin composition as claimed in claim 1, wherein said aromaticthermosetting resin comprises a phenol resin having a novolak structure.4. The flame retardant resin composition as claimed in claim 1, whereinsaid aromatic thermosetting resin comprises a phenol aralkyl epoxy resinhaving aromatic rings on a novolak-structured main chain.
 5. The flameretardant resin composition as claimed in claim 4, wherein said phenolaralkyl epoxy resin has at least any one of biphenyl derivatives andphenylene derivatives on said novolak-structured main chain.
 6. Theflame retardant resin composition as claimed in claim 1, wherein saidaromatic thermosetting resin comprises a phenol aralkyl phenol resinhaving aromatic rings on a novolak-structure main chain.
 7. The flameretardant resin composition as claimed in claim 6, wherein said phenolaralkyl phenol resin has at least any one of biphenyl derivatives andphenylene derivatives on said novolak-structure main chain.
 8. A flameretardant phenol resin material, comprising: A phenol condensate,wherein a poly-aromatic compound obtained by a condensation reaction ofphenols (A) to aromatics (B) except for phenols and a heterocycliccompound (C) including nitrogen as a heteroatom are condensed viaaldehydes (D), wherein said aromatics (B) are represented by thefollowing chemical formula (1), XH₂C—R₁—CH₂X  (1) wherein R₁ is any oneof biphenyl derivatives, phenylene derivatives, naphthalene derivatives,biphenylene derivatives, fluorine derivatives, bis-phenol fluorinederivatives, and X is any one of halogen atoms, hydroxyl groups andalkoxyl groups having not larger than 10 carbon atoms, said flameretardant material further comprises at least a flame retardant phenolresin material, and said flame retardant material further comprises anaromatic thermosetting resin comprising aromatic rings on a main chainskeleton.
 9. A flame retardant epoxy resin material, comprising: anepoxy resin obtained by glycidyl-etherification of at least a part ofphenolic hydroxyl groups of a poly-aromatic compound obtained by acondensation reaction of phenols (A) to aromatics (B) except for phenolsand a heterocyclic compound (C) including nitrogen as heteroatom viaaldehydes (D).
 10. The flame retardant epoxy resin material as claimedin claim 9, wherein said aromatics (B) are represented by the followingchemical formula (1) XH₂C—R₁—CH₂X  (1)where R₁ is any one of biphenylderivatives, phenylene derivatives, naphthalene derivatives, biphenylenederivatives, fluorine derivatives, bis-phenol fluorine derivatives, andX is any one of halogen atoms, hydroxyl groups and alkoxyl groups havingnot larger than 10 carbon atoms.
 11. The flame retardant epoxy resinmaterial as claimed in claim 10, wherein said R₁ is any one of biphenylderivatives and phenylene derivatives.
 12. The flame retardant epoxyresin material as claimed in claim 9, wherein said heterocyclic compound(C) is triazines.
 13. The flame retardant epoxy resin material asclaimed in claim 12, wherein said triazines include compounds having atleast one amino group.
 14. The flame retardant epoxy resin material asclaimed in claim 12, wherein said triazines are at least one compoundselected from the groups consisting of melamine, acetoguanamine andbenzoguanamine.
 15. A flame retardant resin composition, comprising: atleast a flame retardant epoxy resin material as claimed in claim
 9. 16.The flame retardant resin composition as claimed in claim 15, furtherincluding an aromatic thermosetting resin having aromatic rings on amain chain skeleton.
 17. The flame retardant resin composition asclaimed in claim 16, wherein said aromatic thermosetting resin comprisesan epoxy resin having a novolak structure.
 18. The flame retardant resincomposition as claimed in claim 16, wherein said aromatic thermosettingresin comprises a phenol resin having a novolak structure.
 19. The flameretardant resin composition as claimed in claim 16, wherein saidaromatic thermosetting resin comprises a phenol aralkyl epoxy resinhaving aromatic rings on a novolak-structured main chain.
 20. The flameretardant resin composition as claimed in claim 19, wherein said phenolaralkyl epoxy resin has at least any one of biphenyl derivatives andphenylene derivatives on said novolak-structured main chain.
 21. Theflame retardant resin composition as claimed in claim 16, wherein saidaromatic thermosetting resin comprises a phenol aralkyl phenol resinaromatic rings on a novolak-structured main chain.
 22. The flameretardant resin composition as claimed in claim 21, wherein said phenolaralkyl phenol resin has at least any one of biphenyl derivatives andphenylene derivatives on said novolak-structured main chain.
 23. Theflame retardant resin composition as claimed in claim 15, furtherincluding an aromatic thermoplastic resin having aromatic rings on amain chain skeleton.
 24. A semiconductor device having a sealing resinwhich comprises a flame retardant resin composition as claimed in claim15.
 25. A printed wiring board having an insulator which comprises aflame retardant resin composition as claimed in claim
 15. 26. A moldingmaterial comprising a flame retardant resin composition as claimed inclaim 15.